Semiconductor Technologies & Instruments Pte. Ltd.

Texas Instruments Corporation

Michael D Glucksman

Rajiv Roy

Weerakiat Wahawisan

Troy D Moore

James E Loveless

Dennis M Botkin

Paul Harris Hasten

Charles K Harris

Thomas J Difloria

Michael C Zemek

Joseph S Antao

George Charles Epp

Joseph Antao

A system for transporting and inspecting, seriatim, semiconductor devices with plural prong type or solder ball type leads includes a head for transporting the semiconductor devices from one support structure, such as a tray or tube, to a second support structure, such as a tray or tape, and wherein two dimensional and three dimensional measurements of the positional accuracy of the leads is carried out during the transport process. The inspection apparatus is interposed in the transport path and includes a first optical sensor such as a CCD camera oriented to capture a two dimensional image of the semiconductor device package and compare the image with a predetermined two dimensional image store in a central processing unit (CPU). A high intensity light source, such as a laser, generates a plane of light which is reflected off of the semiconductor device leads to a second optical sensor, also comprising a CCD camera, wherein a so-called three dimensional image is generated to be compared by the CPU with predetermined or calculated positional relationships of the leads to establish coplanarity of the lead tips, or lack thereof. The system includes a sensor located such that the semiconductor device is centered in a field of view of the cameras to capture the respective images. The transport head may be rotated to correct for improper positioning of the device prior to generation of the three dimensional image. The system may interchangeably inspect semiconductor device packages with prong leads extending from one or all sides of a rectangular substrate as well an array of solder ball leads supported on a substrate. A modified arrangement of the inspection system is adapted for inspecting multiple semiconductor devices with solder ball leads and supported on wafer type substrates.

Inspection system and method for leads of semiconductor devices

A lead conditioning system (10) conditions leads (74) of electronic component package (30) and includes a rotary table (16) for holding electronic component package (30) and making accessible the leads (74). A conditioning tool (20) includes conditioner arm (34) and conditioner blade (70) that selectively contacts a predetermined number of the leads (74). A manipulator (22) moves conditioning tool (20) to positions that contact a predetermined number of leads (74) to condition leads (74). A control system (24) controls the operation of manipulator (22).

Programmable lead conditioner

A lead conditioning system (10) provides an offset conditioner (12), a planarity conditioner (14) and a tweeze conditioner station (16), a centering station (18), a transport assembly (20), a cabinet (22) having an input station (24) and an output station (26), and a control electronic control apparatus (28). Offset conditioner (12) conditions the offset spacing between leads of a gull-wing semiconductor device by shifting the leads axially in both directions and returning the leads to a center position according to a predetermined specification. Likewise, planarity conditioner station (14) deforms the leads of the semiconductor device so that the leads are essentially upright then repositions the leads by exerting forces downwardly on the tips of the leads so that the tips of the leads of the semiconductor device are essentially shifted to a coplanar position according to a predetermined specification. Offset conditioner (12) features a self-centering device with blades which accurately center the semiconductor device when the self-centering device is lowered thereover. Offset conditioner (12) also features a blade unit which is constructed with successive laminations of steel for enhanced strength and durability of the blades despite the thin width thereof.

Lead conditioner for Quad semiconductor packages

Growing community of inventors

Plano, TX, United States of America

Michael D Glucksman