Marvell International Technology Ltd

Marvell International Limited

Avago Technologies General IP (singapore) Pte. Ltd.

Avago Technologies Ecbu IP Pte. Ltd.

Michael D Cusack

Randall Don Briggs

Michael G Kelly

Thomas Omega Wheless, Jr

Ravindhar K Kaw

Steven F Wald

Salvador Salcido, Jr

Embodiments of the present invention provide electrical bussing for multichip leadframes. In various embodiments, a leadframe may comprise a first die paddle for receiving a first microelectronic device, a second die paddle for receiving a second microelectronic device, and at least one electrical bus disposed between the first die paddle and the second die paddle.

Multichip package leadframe including electrical bussing

An integrated circuit includes a first and a second die positioned on a lead frame of a package. The lead frame includes a plurality of bond fingers. The integrated circuit includes a first bond pad on the first die that is electrically interconnected to a corresponding second bond pad on the second die through first and second bond fingers of the lead frame. The package may be a QFP, DIP, PLCC, TSOP, or any other type of package including a lead frame.

System and method for routing signals between side-by-side die in lead frame type system in a package (SIP) devices

An integrated circuit or chip includes a first die and a second die positioned on a lead frame of a package including a lead frame, such as a QFP, DIP, PLCC, TSOP, or any other type of package including a lead frame. The integrated circuit further includes a redistribution layer formed on the first die to couple selected bond fingers of the lead frame to selected bonding pads of the first and second die. The selected bond fingers may correspond to bond fingers that receive a first supply voltage or the first supply voltage and a second supply voltage.

System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices

Embodiments of the present invention provide leadframes including a die paddle including one or more apertures defined therein, and electronic packages employing the same and having a microelectronic device mounted on the die paddle over one or more of the apertures. Other embodiments may be described and claimed.

Leadframe including die paddle apertures for reducing delamination

Embodiments of the present invention provide electrical bussing for multichip leadframes. In various embodiments, a leadframe may comprise a first die paddle for receiving a first microelectronic device, a second die paddle for receiving a second microelectronic device, and at least one electrical bus disposed between the first die paddle and the second die paddle. In various ones of these embodiments, the electrical bus may be configured to supply a potential to at least one of the first and second microelectronic devices.

A Quad Flat Pack (QFP) package which includes first and second dies arranged in a side-by-side orientation, and a power supply bus which protrudes between adjacent sides of the first and second dies and which supplies power to the adjacent sides via connections to the adjacent sides.

Quad flat pack (QFP) package and flexible power distribution method therefor

An integrated circuit (IC) package, such as a Quad Flat Pack (QFP), has at least one lead with a tip that extends substantially perpendicular to the ends of two or more bondwires, so that there is room for more than one bondwire to be attached to it along its length. Thus, bondwires leading from die bondpads that are not adjacent to one another can be efficiently connected to the same lead in a bus-like manner.

System and method for providing a power bus in a wirebond leadframe package

Optics are utilized in an input device such as a mouse or keyboard, for example, to detect a condition of one or more selection indicators, such as whether a key or button has been depressed or a scroll wheel has been rotated. Depressing a key, clicking a button and/or rotating a scroll wheel cause one or more optical signals to be reflected from the corresponding selection indicator onto an optical detector. The optical detector generates electrical signals in response to the light received by the optical detector. A computational device of the input device processes the electrical signals to determine whether a key or button has been depressed, whether a scroll wheel has been rotated, etc. The corresponding information is then input to a computer that is interfaced with the input device.

Method and apparatus for optically detecting selections made on an input device

An integrated circuit including a copper interconnection layer includes an aluminum distribution layer overlying the copper interconnection layer to distribute external electrical signals such as power, ground, and clock signals throughout the die of the device. The distribution layer overlies the copper interconnection layer in a grid pattern which connects to the copper interconnection layer through a plurality of vias. The distribution layer further includes a plurality of wire bond pads to permit wire bonding between the distribution layer and bonding pads of the integrated circuit package.

Growing community of inventors

Boise, ID, United States of America

Michael D Cusack