Itt Corporation

Michael D Conway

David E Hammers

An integrated active array antenna system is disclosed which comprises a 'sandwich style' microwave packaging scheme that includes three principal layers: an antenna layer, a transceiver layer, and a beam forming sub array layer. These three layers are arranged in a coplanar geometry, with connections between the layers being in the form of microwave vias. Each transceiver module may be implemented in the form of a single Monolithic Microwave Integrated Circuit, and each beam forming sub array may be similarly implemented. The coplanar geometry and use of Monolithic Microwave Integrated Circuit technology provide for multi-beam active array of very shallow physical depth.

Growing community of inventors

Roanoke, VA, United States of America

Michael D Conway