Micron Technology Incorporated

Texas Instruments Corporation

Michael D Chaine

James E Davis

Kyle K Kirby

William Mark Hiatt

Xiaofeng Fan

Jeffery W Janzen

Charvaka Duvvury

Eric J Smith

Manny K F Ma

Salman Akram

Brent Keeth

Troy A Manning

Todd A Merritt

John David Porter

Brian L Johnson

Shubneesh Batra

Chris G Martin

Milind Nemchand Furia

Manny K Ma

Wen Qian Li

Scott E Smith

Puvvada Venugopal

Russell D Slifer, Legal Representative

Thuyanh Bui

Xaiofeng Fan

Circuits, integrated circuits, apparatuses, and methods, such as those for protecting circuits against electrostatic discharge events are disclosed. An example apparatus comprises a thyristor coupled to a node and configured to limit the voltage and discharge the current associated with an over-voltage event at the node. The over-voltage event includes a negative voltage having a magnitude that exceeds a trigger voltage of the thyristor. The example apparatus further comprising a transistor coupled to the thyristor and configured to adjust the magnitude of the trigger voltage.

Apparatuses and method for over-voltage event protection

An apparatus includes a protection circuit electrically connected to first and second voltage domains. The protection circuit includes a first silicon-controlled rectifier (SCR) and a second SCR connected in anti-parallel configuration. The first SCR is configured to connect the first voltage domain and the second voltage domain based on detection of a first triggering condition. The second SCR is configured to connect the second voltage domain and the first voltage domain based on detection of a second triggering condition. The protection circuit is configured to isolate the first and second voltage domains without the triggering conditions.

Apparatus with voltage protection mechanism

Protection circuits and methods for protecting an integrated circuit against an over-limit electrical condition are provided. One example includes a snapback circuit having at least a portion formed in an isolated doped well region and configured to switch to a low impedance state in response to an input exceeding a trigger condition and further having a control circuit coupled to a reference voltage and further coupled to the isolated doped well region and the portion of the snapback circuit formed in the doped well region. The control circuit includes an impedance adjustable in response to a control signal and configured to adjust an isolated doped well impedance in which at least a portion of the snapback circuit is formed relative to the reference voltage. A modulated trigger and hold condition tot the snapback circuit can be set according to a control signal adjusting an electrical impedance of the control circuit.

Over-limit electrical condition protection circuits for integrated circuits

Pass-through 3D interconnects and microelectronic dies and systems of stacked dies that include such interconnects to disable electrical connections are disclosed herein. In one embodiment, a system of stacked dies includes a first microelectronic die having a backside, an interconnect extending through the first die to the backside, an integrated circuit electrically coupled to the interconnect, and a first electrostatic discharge (ESD) device electrically isolated from the interconnect. A second microelectronic die has a front side coupled to the backside of the first die, a metal contact at the front side electrically coupled to the interconnect, and a second ESD device electrically coupled to the metal contact. In another embodiment, the first die further includes a substrate carrying the integrated circuit and the first ESD device, and the interconnect is positioned in the substrate to disable an electrical connection between the first ESD device and the interconnect.

Disabling electrical connections using pass-through 3D interconnects and associated systems and methods

Apparatuses and methods for protecting a circuit from an over-limit electrical condition are disclosed. One example apparatus includes a protection circuit coupled to a circuit to be protected. The circuit to be protected is coupled to a pad node. The protection circuit is configured to conduct current from the pad node to a reference voltage node to protect the circuit from an over-limit electrical condition. The protection circuit has a trigger circuit coupled to the pad node and configured to trigger a shunt circuit to conduct current from the pad node to the reference voltage node responsive to a voltage provided to the pad node having a voltage exceeding a trigger voltage. In some embodiments, the trigger circuit is matched to the circuit being protected.

Over-limit electrical condition protection circuits and methods

Apparatuses, circuits, and methods are disclosed for biased protection circuits for dual-direction nodes. In one such example apparatus, a protection circuit is coupled to a dual-direction node, and includes a positive protection component and a negative protection component. The protection circuit is configured to protect the dual-direction node during an over-limit electrical condition. The protection circuit is configured to control a turn-on condition of the protection circuit.

Apparatuses, circuits, and methods for protection circuits for dual-direction nodes

Circuits, integrated circuits, apparatuses, and methods, such as those for protecting circuits against electrostatic discharge events are disclosed. In an example method, a thyristor is triggered to conduct current from a signal node to a reference voltage node using leakage currents provided by a transistor formed in a semiconductor doped well shared with the base of the thyristor. The leakage currents are responsive to a noise event (e.g., electrostatic discharge (ESD) event) at the signal node, and increase the voltage of the semiconductor doped well to forward bias the base and the collector of the thyristor. The triggered thyristor conducts the current resulting from the ESD event to the reference voltage node.

Combination ESD protection circuits and methods

Integrated circuits, memories, protection circuits and methods for protecting against an over-limit electrical condition at a node of an integrated circuit. One such protection circuit includes a snapback circuit having at least a portion formed in an isolated doped well region and configured to switch to a low impedance state in response to an input exceeding a trigger condition and further having a control circuit electrically coupled to a reference voltage and further electrically coupled to the isolated doped well region and the portion of the snapback circuit formed in the doped well region. The control circuit includes an impedance adjustable in response to a control signal and configured to adjust an isolated doped well impedance in which at least a portion of the snapback circuit is formed relative to the reference voltage. A modulated trigger and hold condition for the snapback circuit can be set according to a control signal adjusting an electrical impedance of the control circuit.

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Boise, ID, United States of America

Michael D Chaine