Ultrasource, Inc.

Other

Michael D Casper

William B Mraz

Craig Hare

Adam Cook

The system contains a substrate having at least one electrical trace formed thereon. An opening is formed in the substrate. The opening comprising at least one wall. An electrically conductive fill is formed in the opening. The electrically conductive fill is chemically bonded to the wall and electrically contacted with the electrical trace.

Method and apparatus for an improved filled via

A system and method for the fabrication of high reliability capacitors (), inductors (), and multi-layer interconnects () (including resistors ()) on various thin film hybrid substrate surfaces () is disclosed. The disclosed method first employs a thin metal layer () deposited and patterned on the substrate (). This thin patterned layer () is used to provide both lower electrodes for capacitor structures () and interconnects () between upper electrode components. Next, a dielectric layer () is deposited over the thin patterned layer () and the dielectric layer () is patterned to open contact holes () to the thin patterned layer. The upper electrode layers () are then deposited and patterned on top of the dielectric ().

Integrated thin film capacitor/inductor/interconnect system and method

A system and method for the fabrication of high reliability high performance Lange couplers (optionally including capacitors (), inductors (), multi-layer interconnects (), and resistors ()) on various thin film hybrid substrate surfaces () is disclosed. The disclosed Lange coupler method first employs a thin metal layer () deposited and patterned on the substrate (). This thin patterned layer () is used to provide both lower electrodes for capacitor structures () and interconnects () between upper electrode components. Next, a dielectric layer () is deposited over the thin patterned layer () and the dielectric layer () is patterned to open contact holes () to the thin patterned layer. The upper electrode layers () are then deposited and patterned on top of the dielectric (). The resulting Lange coupler structure has significantly improved electrical performance over the prior art, while incorporating overall structural integrity superior to that of the prior art.

Lange coupler system and method

A system and method for the fabrication of high reliability capacitors ( ), inductors ( ), and multi-layer interconnects ( ) (including resistors ( )) on various thin film hybrid substrate surfaces ( ) is disclosed. The disclosed method first employs a thin metal layer ( ) deposited and patterned on the substrate ( ). This thin patterned layer ( ) is used to provide both lower electrodes for capacitor structures ( ) and interconnects ( ) between upper electrode components. Next, a dielectric layer ( ) is deposited over the thin patterned layer ( ) and the dielectric layer ( ) is patterned to open contact holes ( ) to the thin patterned layer. The upper electrode layers ( ) are then deposited and patterned on top of the dielectric ( ).

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Nashua, NH, United States of America

Michael D Casper