Methode Electronics, Incorporated

Dualsonic, Inc.

Michael Chy Chao

Jeffrey Lee Allen

Ryan Kimura

Iggoni Fajardo

Scott Herbert

James Farquhar

Stephen Hatch

Brandt Weibezhan

An electronic housing is provided comprising a first cover assembly combinable with a second cover assembly to house or enclose a printed circuit board therebetween. Each cover assembly includes a cover and a frame, the cover attachable to the frame by bending portions of the cover thereabout. The cover is preferably stamped metal and the frame is preferably injection molded plastic. Each cover may include recesses such that, when the cover is bent around the frame, the cover bends at the recesses and closely engages the frame on multiple mating surfaces. The cover assemblies may be welded together, such as by ultrasonic welding, to form a complete package or housing, and may include intermittingly spaced shear weld features to improve bond strength therebetween. Methods of manufacturing and/or assembling electronic housings and cover assemblies are also provided.

Electronic housing, assemblies therefor and methods of making same

A PCB package for shielding electromagnetic radiation from exiting or entering the package. In one embodiment the package includes first and second electrically conductive covers and first and second electrically conductive frames. The first frame electrically connected to the first cover and the second frame electrically connected to the second cover. The first frame is then electrically connected to the second frame. The first and second frames can be made of electrically conductive plastics or metals or any other electrically conductive materials. Methods of assembling the packages of the various embodiments are also set forth.

Shielded PC card packages

Method of assembling a peripheral device printed circuit board package

Growing community of inventors

San Jose, CA, United States of America

Michael Chy Chao