Google Inc.

Michael Chi Kin Lau

Winnie Leung

Jayson Michael Jochim

Angela Chen

Soheil Farshchian

Bill Dailey

Jeffrey Scott Spaulding

William Frank Edwards

Melanie Beauchemin

Justin Sishung Lee

Madhusudan K Iyengar

Zuowei Shen

Federico Pio Centola

Jinal Dalal

Timothy Conrad Lee

Peter Pellerzi

Richard C Bruns

Justin S Lee

William Dailey

Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

Thermal optimizations for OSFP optical transceiver modules

A data center rack system includes a rack housing that includes side panels and a top panel coupled to the side panels, the top and side panels defining a rack volume sized to enclose a plurality of data center server rack trays, each of the data center server rack trays configured to support a plurality of heat generating electronic devices; and a rack bottom coupled to the side panels to at least partially define the rack volume, the rack bottom including a bottom panel having a top surface coupled to the side panels and a plurality of blocks coupled to a bottom surface of the bottom panel opposite the top surface, at least one pair of the plurality of blocks defining an opening between the blocks and below the bottom surface of the bottom panel and sized to receive a lifting member of a lifting machine.

Supporting rack-mounted computing devices

Techniques for managing data center electronic devices in a data center include operating data center server devices that define a particular amount of computing power of a data center, the devices supported in server racks positioned in a frame assembly that includes bays defined along a lengthwise dimension of the frame assembly, the bays arranged in stacked layers that include at least a first layer of bays and a second layer of bays positioned vertically above the first layer of bays, the server racks positioned in at least one of the bays of the first or second layers of bays; determining that at least one of the server devices requires a maintenance operation; based on the determination, operating an automated service machine to move to a location in the data center that is adjacent to the data center server device; and performing the maintenance operation on the at least one data center server device with the automated service machine.

Managing a data center

A data center system includes a frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, the plurality of bays arranged in a plurality of stacked layers of bays, the plurality of stacked layers including at least a first layer of bays and a second layer of bays positioned vertically above the first layer of bays; a plurality of server racks positioned in the bays of the first layer of bays, each of the server racks configured to support a plurality of data center server devices that define a particular amount of computing power; and a plurality of network switches positioned in the bays of the second layer of bays, each of the network switches communicably coupled to at least one of the data center server devices in the first layer of bays.

A data center cooling system includes a server rack frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, each bay including a volume defined at least in part by a specified height that is orthogonal to the lengthwise dimension and a specified width that is parallel to the lengthwise dimension and sized to at least partially enclose at least one server rack configured to support a plurality of data center computing devices; and at least one cooling unit sized for a bay of the plurality of bays of the server rack frame assembly and configured to circulate a heated airflow from an open back side of the at least one server rack, cool the heated air, and circulate a cooling airflow through an open front side of the at least one server rack.

Data center cooling system with stacked rows of server racks

An apparatus includes a housing having a bottom surface and one or more mounting members that enable the housing to be mounted in a rack. The apparatus includes liquid cooling components mounted within the housing. The liquid cooling components include tubing within which a coolant may be communicated, and a heat exchange component that thermally couples a heat load within the housing to the coolant so that heat from the heat load is transferred to the coolant. The bottom surface of the housing defines a drain path. The heat exchange component is positioned in a downward direction of gravity relative to the heat load when the housing is mounted in the rack. In the event of a coolant leak, the coolant leak will occur beneath the heat load and the coolant will flow away from the heat load and exit the housing by use of the drain path.

Inverted liquid cooling system

Cooling electronic devices in a data center with cooling units mounted in bays of a server rack frame assembly

A computer component mounting assembly includes a carrier to support a hard drive and a data connector. The carrier is configured to slidably receive the hard drive along a first axis. The data connector includes a first connector configured to mate to pins of the hard drive, a second connector configured to mate to a SATA data connector, and a flexible cable connecting the two. The first connector includes an alignment feature to engage a corresponding alignment feature on the hard drive. The first connector is coupled to the carrier and slidable in a plane perpendicular to the first axis, and the first connector is configured such that when carrier receives the hard drive and the alignment feature engages the corresponding alignment feature the first connector moves in the plane perpendicular to the first axis to provide alignment of the first connector to the pins of the hard drive.

Computer component connector

A server rack sub-assembly includes at least one motherboard having a perimeter; a plurality of heat-generating electronic devices mounted on the motherboard in an area of the motherboard thermally decoupled from the motherboard perimeter; one or more brackets including heat transfer surfaces and attached to the motherboard along at least a portion of the motherboard perimeter; and a heat transfer device thermally coupled to the area of the motherboard that is thermally decoupled from the motherboard perimeter and the one or more brackets. The one or more brackets are adapted to receive a cooling airflow circulated over the bracket and to convectively transfer heat into the cooling airflow and are further adapted to couple the motherboard to a server rack assembly. The heat transfer device is arranged to conductively transfer heat from the one or more electronic devices to the brackets.

Growing community of inventors

San Francisco, CA, United States of America

Michael Chi Kin Lau