Orthodyne Electronics Corporation

Union Oil Company of California

Michael C Smith

Hal W Smith, Jr

Walter Albertson

Marvin J Schwedock

David A Lindsay

An improved ultrasonic wire bonding method and apparatus is disclosed having a wire delivery conduit for removing coil set in the wire through a serpentine movement prior to being bonded, which also provides sufficient drag to prevent displacement as the bonder with the wire is being moved from one location to another, and which orients the wire to said bonding tool end. An improved wire cutter moves independently of the wire bonding tool and is directly connected to the main Z positioning movement of said wire bonder so that the wire bonding tool and the cutter can move independently during the process. The wire bonding tool can be biased by a magnetic bias with an armature connected to the wire bonding tool. The wire bonding apparatus and the method provide a loop in the wire between first and second bonds by forming an arcuate bend in the wire as it moves away from the first point of bonding. After a second bond, the wire is partially cut by a cutter that moves relative to the bonding tool to partially cut the wire which is then severed by pulling the bonding tool and cleating the wire in the end thereof.

Ultrasonic wire bonder wire formation and cutter system

In the catalytic processing of hydrocarbons, a hydrocarbon oil is successively contacted with a particulate catalyst in a first reaction zone and contacted at a higher temperature with a second portion of the particulate catalyst in the same reaction zone or in a second reaction zone.

Temperature controlled catalytic demetallization of hydrocarbons

The following specification discloses a touchdown sensor for ultrasonic wire bonding devices. Such ultrasonic wire bonding devices are used for purposes of bonding wires to integrated circuits, package terminations, hybrids, and discrete semiconductor devices. The devices entail the utilization of a transducer that operates in a series resonant mode. The means of exciting the resonant mode is through an electrical signal imparted thereto, so that a tool attached to the transducer can then impart an ultrasonic bond to a wire with which it is placed in contact. The tool attached to the transducer is lowered by the device to a discrete location. The point of contact is monitored by sensing an increased impedance by contact of the tool and dampening of the transducer's resonant mode. This increased impedance is read by means of producing a voltage proportional to transducer current and determining when it has decreased below a previously set reference voltage. A comparator then makes a comparison of the reference voltage with respect to the decreased voltage and signals a control microprocessor to stop the device. This is done by preventing a motor from carrying the tool farther after it has made contact with the work.

Ultrasonic wire bond touchdown sensor

The second wire bond is made in a semiconductor circuit simultaneously with breaking of the wire, in such manner that a 'tailless' wirebond is achieved in minimum time and with no damage to either the wire or the bonding pad. The bond is made ultrasonically, and tension is applied to the wire during the actual time that ultrasonic bonding energy is supplied to the bonding tool. Such tension is applied by a spring or its equivalent, and is so predetermined that application of the bonding energy to the bonding tool will not only create the ultrasonic bond but will also break the wire.

Growing community of inventors

Costa Mesa, CA, United States of America

Michael C Smith