Ormet Circuits, Inc.

Other

Michael C Matthews

Catherine A Shearer

Kenneth C Holcomb

Peter D Zavitsanos

Charles Files

G Delbert Friesen

Dmitri Bohn

Eunsook Barber

Peter A Matturri

Peter A Matturi

Richard Weaver

Arno Gatti

An inventive composition and process for formation of a conductive bonding film are disclosed. The invention combines adhesive bonding sheet technologies (e.g. die attach films, or DAFs) with the electrical and thermal conductivity performance of transient liquid phase sintered paste compositions. The invention films are characterized by high bulk thermal and electrical conductivity within the film as well as low and stable thermal and electrical resistance at the interfaces between the inventive film and metallized adherends.

Conductive film adhesive

A semiconductor die attach composition with greater than 60% metal volume after thermal reaction having: (a) 80-99 wt % of a mixture of metal particles comprising 30-70 wt % of a lead-free low melting point (LMP) particle composition comprising at least one LMP metal Y that melts below a temperature T, and 25-70 wt % of a high melting point (HMP) particle composition comprising at least one metallic element M that is reactive with the at least one LMP metal Y at a process temperature T, wherein the ratio of wt % of M to wt % of Y is at least 1.0; (b) 0-30 wt % of a metal powder additive A; and (c) a fluxing vehicle having a volatile portion, and not more than 50 wt % of a non-volatile portion.

Sintering pastes with high metal loading for semiconductor die attach applications

Sintering die-attach materials provide a lead-free solution for semiconductor packages with superior electrical, thermal and mechanical performance to prior art alternatives. Wafer-applied sintering materials form a metallurgical bond to both semiconductor die and adherends as well as throughout the die-attach joint and do not remelt at the original process temperature. Application to either one or both sides of the wafer, as well as paste a film application are disclosed.

Semiconductor packaging containing sintering die-attach material

Transient liquid phase sintering compositions comprising one or more high melting point metals and one or more low melting temperature alloys are known in the art as useful compositions for creating electrically and/or thermally conductive pathways in electronic applications. The present invention provides transient liquid phase sintering compositions that employ non-eutectic low melting temperature alloys for improved sintering and metal matrix properties.

Electrically conductive compositions comprising non-eutectic solder alloys

The present invention provides conductive metal compositions for electronic applications, and methods of preparation and uses thereof. More specifically, the present invention provides metallic particle transient liquid phase sintering compositions containing blended formulations of metal and metal alloy components that form interconnected conductive metallurgical networks with increased stability, resistance to thermal stress and ability to mitigate CTE mismatch between materials.

Preparation of metallurgic network compositions and methods of use thereof

The present invention provides electrically and thermally conductive compositions for forming interconnections between electronic elements. Invention compositions comprise three or more metal or metal alloy particle types and an organic vehicle comprising a flux that is application specific. The first particle type includes a reactive high melting point metal that reacts with a reactive low melting point metal(s) in the other particles to form intermetallic species. The reactive low melting point metal(s) of the invention are provided in two distinct particle forms. The first reactive low melting point metal particle includes a carrier that facilitates the reaction with the reactive high melting point metal. The second reactive low melting point metal particle acts primarily as a source of the reactive low melting point metal. Combination of the three particle types provides several advantages including reduction of the undesirable characteristics of the carrier metal while preserving and, in some embodiments, enhancing, the advantageous facilitation of the metallic reaction.

Conductive compositions containing blended alloy fillers

A projectile for the destruction of unexploded ordnance comprising a dart shell having a core region which contains a reactive composition comprised of a reactive metal and an oxidizer. The reactive metal is selected from the group consisting of titanium, aluminum, magnesium, lithium, beryllium, zirconium, thorium, uranium, hafnium, alloys thereof, hydrides thereof, and combinations thereof. The oxidizer is selected from the group consisting of lithium perchlorate, magnesium perchlorate, ammonium perchlorate, potassium perchlorate, chlorates, peroxides, and combinations thereof. In an alternative embodiment, the reactive composition is located on the outside of a center penetrating rod. Also included is a disposable apparatus for delivering a projectile to destroy unexploded ordnance. The apparatus is comprised of a block having a top and a bottom, the block comprised of a material selected from the group consisting of wood and polymeric resin. Within the block is a barrel disposed on the bottom of the block, the barrel comprised of a material selected from the group consisting of fiberglass and polymeric resin.

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Encinitas, CA, United States of America

Michael C Matthews