Allegro Microsystems, LLC

Commissariat &#xc0; L'&#xc9;nergie Atomique Et Aux &#xc9;nergies Alternatives

Michael C Doogue

William P Taylor

Shaun D Milano

Andreas P Friedrich

Vijay Mangtani

Alexander Latham

P Karl Scheller

Ravi Vig

Andrea Foletto

Richard Dickinson

Bryan Cadugan

Monica J Thomas

Jay M Towne

Georges El Bacha

Paul A David

Gerardo A Monreal

Sundar Chetlur

David Jamie Haas

Harianto Wong

Nevenka Kozomora

Mark J Donovan

James M Bailey

Hooman Bustani

Michael J Gaboury

Craig S Petrie

Eric G Shoemaker

Jay J Gagnon

Jason Boudreau

Jonathan Lamarre

Juan Manuel Cesaretti

Eric Burdette

Ryan J Metivier

Ricardo Scheinkerman

Richard Vreeland

Gregory Delmain

Marie-Adelaide Lo

Maxim Klebanov

Claude Fermon

Alejandro Gabriel Milesi

Robert A Briano

Myriam Pannetier-Lecoeur

Nirmal Sharma

Jesse Lapomardo

Thomas Kerdraon

David Toebes

John Cummings

Sandra R Pinelle

Evan Shorman

Matthew Hein

Hitoshi Yabusaki

Xavier Du Hamel De Milly

Matthew Regan

A sensor integrated circuit configured to generate a sensor output current indicative of a sensed parameter includes a power connection to receive a supply voltage, a ground connection, a sensing circuit configured to generate a parameter current proportional to the sensed parameter, and an output connection at which the sensor output current is provided. An output current calibration circuit is configured to determine an offset current that corresponds to a bias voltage at the output connection equal to a fixed percentage of the supply voltage when the parameter current is substantially zero. The sensor output current is provided as a combination of the parameter current and the offset current.

Sensor integrated circuit with current output calibration

A sensor package comprising a lead frame, a current sensor die, and an interposer. The lead frame includes: (i) a primary conductor, (ii) a plurality of secondary leads, and (iii) a layer of dielectric material that is disposed between the primary conductor and the plurality of secondary leads. The current sensor die includes one or more sensing elements. The current sensor die is configured to measure a level of electrical current through the primary conductor of the lead frame. The interposer is disposed over the layer of dielectric material. The interposer includes a plurality of conductive traces that are configured to couple each of a plurality of terminals of the current sensor die to a respective one of the plurality of secondary leads.

Leadless current sensor package with high isolation

Systems and methods described herein are directed towards integrating a shield layer into a current sensor to shield a magnetic field sensing element and associated circuitry in the current sensor from electrical, voltage, or electrical transient noise. In an embodiment, a shield layer may be disposed along at least one surface of a die supporting a magnetic field sensing element. The shield layer may be disposed in various arrangements to shunt noise caused by a parasitic coupling between the magnetic field sensing element and the current carrying conductor away from the magnetic field sensing element.

Systems and methods for integrated shielding in a current sensor

A sensor includes a sensing element configured to generate a sensing element output signal indicative of a sensed parameter and a signal path responsive to the sensing element output signal and having at least one of an adjustable gain or an adjustable offset, wherein the signal path is configured to generate a sensor output signal indicative of the sensed parameter. A supply voltage detector is configured to generate a supply voltage signal indicative of which of a plurality of voltage ranges a supply voltage of the sensor falls within and at least one of the adjustable gain or the adjustable offset is adjustable in response to the supply voltage signal.

Supply voltage configurable sensor

A magnetic field sensor includes a lead frame, a passive component, semiconductor die supporting a magnetic field sensing element and attached to the lead frame, a non-conductive mold material enclosing the die and at least a portion of the lead frame, and a ferromagnetic mold material secured to a portion of the non-conductive mold material. The lead frame has a recessed region and the passive component is positioned in the recessed region. The ferromagnetic mold material may comprise a soft ferromagnetic material to form a concentrator or a hard ferromagnetic material to form a bias magnet.

Magnetic field sensor integrated circuit with integral ferromagnetic material

Methods and apparatus for providing an integrated circuit having a drive current source, a magnetic sensing element coupled to the drive current source, the magnetic sensing element having first and second differential outputs, and first and second current elements to provide respective currents in relation to the drive current source, wherein the first current element is coupled to the first differential output and the second current element is coupled to the second differential output. In illustrative embodiments, an IC output can output a voltage corresponding to the currents of the first and second current elements.

Methods and apparatus for sensor diagnostics

An apparatus comprises a first substrate and two coils supported by the first substrate and arranged next to each other, the coils configured to each generate a magnetic field which produces eddy currents in and a reflected magnetic field from a conductive target, the two coils arranged so their respectively generated magnetic fields substantially cancel each other in an area between the coils. One or more magnetic field sensing elements are positioned in the area between the coils and configured to detect the reflected magnetic field.

Packages for coil actuated position sensors

Methods and apparatus for magnetic field sensor having a sensing element, an analog circuit path coupled to the sensing element for generating an output voltage in response to a magnetic field applied to the sensing element, and a coil in proximity to the sensing element, the coil having a first terminal that is accessible external to the magnetic field sensor.

Methods and apparatus for magnetic sensor having an externally accessible coil

Methods and apparatus for a signal isolator having a dielectric interposer supporting first and second die each having a magnetic field sensing element. A first signal path extends from the first die to the second die and a second signal path extends from the second die to the first die. In embodiments, the first signal path is located in the interposer and includes a first coil to generate a magnetic field and the second signal path is located in the interposer and includes a second coil to generate a magnetic filed. The first coil is located in relation to the second magnetic field sensing element of the second die and the second coil is located in relation to the first magnetic field sensing element of the first die.

Signal isolator having interposer

In one aspect, an integrated circuit (IC) includes a magnetic field sensor to detect speed and direction of angular rotation of a rotating magnetic structure. The magnetic field sensor includes at least two magnetic field sensing elements configured to sense changes in a magnetic field caused by rotation of the magnetic structure. The IC also includes an output port configured to provide an output signal of the magnetic field sensor. The frequency of the output signal indicates the speed and the direction or indicates a fault.

Frequency of an output signal of a magnetic field sensor to detect speed and direction of angular rotation of a rotating magnetic structure or a fault

In one aspect, an integrated circuit (IC) includes a magnetic field sensor to detect speed and direction of angular rotation of a rotating magnetic structure. The magnetic field sensor includes at least two magnetic field sensing elements configured to sense changes in a magnetic field caused by rotation of the magnetic structure. The IC also includes an output port configured to provide an output signal of the magnetic field sensor. A duty cycle percentage of the output signal indicates the speed and the direction or indicates a fault.

Duty cycle of an output signal of a magnetic field sensor to detect speed and direction of angular rotation of a rotating magnetic structure or a fault

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Manchester, NH, United States of America

Michael C Doogue