Infineon Technologies Ag

Infineon Technologies Flash Gmbh & Co. Kg

Michael Bollu

Thomas Nirschl

Jan Otterstedt

Wolf Allers

Michael Bernhard Sommer

Christian Peters

Josef Willer

Christoph Ludwig

Nigel Chan

Herbert Palm

Armin Kohlhase

Mayk Roehrich

Tobias Schlager

Eric-Roger Br&uuml;cklmeier

Dimitri Lebedev

One or more embodiments may be related to a method of operating a phase-change memory element, comprising: providing the phase-change memory element, the phase-change memory element having a first terminal and a second terminal; causing a first current through the memory element from the first terminal to the second terminal; and causing a second current through the memory element from the second terminal to the first terminal, wherein the causing the first current programs the memory element from a first resistance state to a second resistance state and the causing the second current programs the memory element from the first resistance state to the second resistance state.

Method of operating phase-change memory

Embodiments of the invention describe compact memory arrays. In one embodiment, the memory cell array includes first, second, and third gate lines disposed over a substrate, the second gate lines are disposed between the first and the third gate lines. The first, the second, and the third gate lines form adjacent gate lines of the memory cell array. The memory cell array further includes first metal lines disposed over the first gate lines, the first metal lines coupled to the first gate lines; second metal lines disposed over the second gate lines, the second metal lines coupled to the second gate lines; and third metal lines disposed over the third gate lines, the third metal lines coupled to the third gate lines. The first metal lines, the second metal lines and the third metal lines are disposed in different metallization levels.

Compact memory arrays

In one embodiment, a bit-line interface is disclosed. The bit-line interface has a multiplexer having a plurality of bit-line outputs, and a write path coupled to a multiplexer signal input. The bit-line interface also has a read path coupled to the multiplexer signal input, wherein the read path and the write path share at least one component.

System and method for level shifter

Non volatile memories and methods of programming thereof are disclosed. In one embodiment, the method of programming a memory array includes receiving a series of data blocks, each data block having a number of bits that are to be programmed, determining the number of bits that are to be programmed in a first data block, determining the number of bits that are to be programmed in a second data block, and writing the first data block and the second data block into the memory array in parallel if the sum of the number of bits that are to be programmed in the first data block and the second data block is not greater than a maximum value. The first and second data blocks may or may not be adjacent data blocks. Improved programming efficiency may be achieved in a memory circuit when the maximum allowable current may be limited by the application or the size of a charge pump. Inverse data may be written in parallel if the sum is greater than the maximum value.

Memory circuit and method for programming in parallel a number of bits within data blocks

A method of operating an integrated circuit includes applying at least one first programming pulse to a plurality of non-volatile memory cells to adjust a level of a storage parameter of each of the non-volatile memory cells, the at least one first programming pulse defined by a plurality of pulse parameters each having a fixed valued, and determining a fail count by measuring the number of non-volatile memory cells of the plurality of non-volatile memory cells having a storage parameter level exceeding a verify level. The method further includes determining a change in an programming behavior of the plurality of non-volatile memory cells based on the fail count, adjusting a value of at least one pulse parameter of at least one second programming pulse defined by the plurality of pulse parameters to a desired value based on the change in programming behavior, and applying the at least one second programming pulse to the plurality non-volatile memory cells.

Non-volatile memory with predictive programming

One or more embodiments are related to a method of operating a phase-change memory array, including: providing the phase-change memory array, the phase-change memory array including a phase-change memory element in series with an access device between a first address line and a power line; causing a first current through the memory element from the first address line to the power line; and causing a second current through the memory element from the power line to the first address line.

In an embodiment, a memory cell arrangement is provided. The memory cell arrangement may include a first memory cell and a second memory cell, a first source/drain line coupled to a first source/drain region of the first memory cell and a second source/drain line coupled to a second source/drain region of the first memory cell, and a third source/drain line coupled to a first source/drain region of the second memory cell and a fourth source/drain line coupled to a second source/drain region of the second memory cell, wherein the third source/drain line is disposed proximate to the second source/drain line, and wherein the third source/drain line is disposed in the same metallization level as the second source/drain line.

Memory cell arrangements

A data retention monitor for a memory cell including a voltage source and a voltage comparator. The voltage source is adapted to provide a selectable voltage to the memory cell. The selectable voltage includes a read voltage and a test voltage, with the test voltage being greater than the read voltage. The voltage comparator is adapted to compare a voltage of the memory cell with a reference voltage after the provision of the selectable voltage to the memory cell. The memory cell retains data when the memory cell voltage generated at least in part by the test voltage is substantially equal to the reference voltage.

Data retention monitor

A device for reading out memory information storable in a memory has an integrator and a comparator. The memory provides, in a hold phase, a leakage current, and in a readout phase, a readout current. The readout current is dependent on the stored memory information. The integrator is adapted to integrate a quantity derived from the leakage current during the hold phase, and to provide a leakage voltage corresponding to an integrated leakage current. The integrator is further adapted to integrate a quantity derived from the readout current during the readout phase, and to provide a readout voltage corresponding to an integrated readout current. The comparator may compare the leakage voltage to the readout voltage and provide, in dependence on the comparison, a readout value corresponding to the memory information.

Device and method for reading out memory information

In the case of this semiconductor memory having NROM cells, the channel regions of the memory transistors in each case run transversely with respect to the relevant word line, the bit lines are arranged on the top side of the word lines and in a manner electrically insulated from the latter, and electrically conductive cross-connections are present, which are arranged in sections in interspaces between the word lines and in a manner electrically insulated from the latter and are connected to the bit lines in each case in next but one sequence.

Semiconductor memory having charge trapping memory cells and fabrication method

A configuration is described for evaluating a signal that is read from a ferroelectric storage capacitor, in which, in addition to positive and negative polarization states, a weak polarization state is evaluated. Using the configuration, a data storage characteristic of the memory cells can be monitored, and a manipulation attempt can be detected.

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Kirchheim, Germany

Michael Bollu