Intel Corporation

Michael Berktold

Sandeep Ahuja

Krishnakanth Venkata Sistla

Tessil Thomas

Robin A Steinbrecher

Phani Kumar Kandula

Timothy Y Kam

Howard Chin

Javier Avalos Garcia

Adriana Lopez Iniguez

Luz Karine Sandoval Granados

Jeremy Ridge

Jun Zhang

Damion T Searls

David Shia

Richard J Dischler

Barrett M Faneuf

Jin Yang

Eric W Buddrius

Bijoyraj Sahu

Kenan Huseyin Arik

Prabhakar Subrahmanyam

Catharina Biber

Ying-Feng Pang

Kristin L Weldon

Yi Xia

Brendan T Pavelek

Victor Polyanko

Carlos Alvizo Flores

Lianchang Du

Minh T D Le

Yuyang Xia

Yuehong Fan

Mark Bianco

Samer Melhem

Jeffrey Ryan Conner

John Raatz

Bergen Anderson

Shengzhen Zhang

Yuan Li

Hemant Desai

An apparatus is described. The apparatus includes a cover to enclose a junction between respective ends of first and second fluidic conduits. The first and second fluidic conduits transport a coolant fluid within an electronic system. The apparatus also includes a leak detection device to be located within a region that is enclosed by the cover when the junction is enclosed by the cover. The leak detection device is to detect a leak of the coolant fluid at the junction when the junction is enclosed by the cover. The first and second fluidic conduits extend outside the cover when the junction is enclosed by the cover. Another apparatus is also described. The other apparatus includes a leak detection device to detect a leak of coolant fluid from a specific component or junction in a liquid cooling system of an electronic system.

Liquid cooling system leak detection improvements

In an embodiment, a processor includes at least one core and power management logic. The power management logic is to receive temperature data from a plurality of dies within a package that includes the processor, and determine a smallest temperature control margin of a plurality of temperature control margins. Each temperature control margin is to be determined based on a respective thermal control temperature associated with the die and also based on respective temperature data associated with the die. The power management logic is also to generate a thermal report that is to include the smallest temperature control margin, and to store the thermal report. Other embodiments are described and claimed.

Apparatus and method to provide a thermal parameter report for a multi-chip package

A liquid cooling system is described. The liquid cooling system includes a heat sink to provide a warmed liquid. The heat sink is to receive heat generated by at least one semiconductor chip of an electronic system. The liquid cooling system includes a heat exchanger to receive the warmed liquid and to provide a cooled liquid. The liquid cooling system includes a pump. The pump is to draw the cooled liquid at the pump's input so that respective pressures of the warmed and cooled liquids' are less than atmospheric pressure.

Liquid cooling system with sub atmospheric pressure coolant

In one embodiment, a processor comprises: a first die including at least one core and at least one first die thermal sensor; a second die including at least one memory and at least one second die thermal sensor; and a thermal controller to receive first thermal data from the at least one first die thermal sensor and second thermal data from the at least one second die thermal sensor, calculate a first thermal margin for the first die based at least in part on the first thermal data and a first thermal loadline for the first die and calculate a second thermal margin for the second die based at least in part on the second thermal data and a second thermal loadline for the second die. Other embodiments are described and claimed.

Determining thermal margins in a multi-die processor

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Phoenix, AZ, United States of America

Michael Berktold