Heraeus Deutschland Gmbh & Co Kg

Osram Opto Semiconductor Gmbh

Alanod Gmbh & Co. Kg

Michael Benedikt

Eckhard Ditzel

Jörg Erich Sorg

Wolfgang Schmitt

Michael Schäfer

Stefan Ziegler

Thomas Krebs

Andreas Hinrich

Andreas Steffen Klein

Alexander Peetsch

Martin Bleifuss

Siegfried Walter

Alexander Brand

Udo Becker

Michael Austgen

Reinhard Ditzel

A method of producing at least one connection carrier includes: A) providing a carrier plate with a planar top face; B) applying at least one electrically insulating insulation strip to the top face and cohesively connecting the carrier plate and the insulation strip; and C) applying at least one electrically conductive conductor strip to an adhesive surface of the insulation strip and cohesively connecting the insulation strip and the conductor strip, wherein the conductor strip and the carrier plate are electrically insulated from one another by the insulation strip.

Method of producing a connection support, connection support and optoelectronic semiconductor component comprising a connection support

A carrier and the clip are used to produce a packaging having a lead frame by connection to the chip using sintering of the solidified sintering pastes in one work step. The carrier may be a lead frame and a clip for at least one semiconductor element has at least one functional surface for connecting to the semiconductor element and a plurality of connections. The material of the earlier or of the clip includes a metal and a layer made of a solidified sintering paste. The sintering paste may contain silver and/or a silver compound. The sintering paste is arranged on the functional surface. The carrier or clip and the layer made of sintering paste form an intermediate product that can be connected to the semiconductor element.

Carrier and clip each having sinterable, solidified paste for connection to a semiconductor element, corresponding sintering paste, and corresponding production method and use

A strip-shaped substrate made from a film includes a plurality of units for producing chip carriers. Each unit has a chip island for fixing a semiconductor chip, electrodes for electrical connection of the semiconductor chip, and through-openings for structuring the unit. At least one through-opening forms an anchoring edge for a casting compound for encapsulating the semiconductor chip. A surface section of the film abutting the through-opening is chamfered to form the anchoring edge. The anchoring edge protrudes past the side of the film on which the chip island is arranged.

Strip-shaped substrate for producing chip carriers, electronic module with a chip carrier of this type, electronic device with a module of this type, and method for producing a substrate

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Neuberg, Germany

Michael Benedikt