Vishay Intertechnology, Inc.

Vishay Israel Ltd.

Michael Belman

Leonid Akhtman

An electronic component comprising a body and at least one terminal for soldering the body to a carrier is provided, with the terminal comprising: an electrode arranged on a surface of the body; an outgassing layer formed on and/or surrounded by the electrode, wherein the outgassing layer is configured to outgas when being heated; and an electrically conductive cover layer formed on the outgassing layer, wherein the cover layer is electrically connected to the electrode and seals the outgassing layer in a gastight manner between the cover layer and the electrode.

Electronic component with flexible terminal

A chip resistor includes an insulating substrate, top terminal electrodes formed on top surface of the substrate using silver-based cermet, bottom electrodes, resistive element that is situated between the top terminal electrodes and overlaps them partially, an optional internal protective coating that covers resistive element completely or partially, an external protective coating that covers completely the internal protection coating and partially covers top terminal electrodes, a plated layer of nickel that covers face sides of the substrate, top and bottom electrodes, and overlaps partially external protective coating, finishing plated layer that covers nickel layer. The overlap of nickel layer and external protective layer possesses a sealing property because of metallization of the edges of external protective layer prior to the nickel plating process.

Sulfuration resistant chip resistor and method for making same

A chip resistor includes an insulating substrate, top terminal electrodesformed on top surface of the substrate using silver-based cermet, bottom electrodes, resistive elementthat is situated between the top terminal electrodesand overlaps them partially, an optional internal protective coatingthat covers resistive elementcompletely or partially, an external protective coatingthat covers completely the internal protection coatingand partially covers top terminal electrodes, a plated layer of nickelthat covers face sides of the substrate, topand bottomelectrodes, and overlaps partially external protective coating, finishing plated layerthat covers nickel layer. The overlap of nickel layerand external protective layerpossesses a sealing property because of metallization of the edges of external protective layerprior to the nickel plating process.

A chip resistor comprising a substrate having opposite parallel symmetrical first and second surfaces, a central longitudinal plane of symmetry, separate and spaced first and second resistive layers on the first and second surfaces. The resistive layers are electrically connected in parallel to each other and the first and second surfaces of the substrate are symmetrically located with respect to and equidistant from a central longitudinal plane. Thus, when electrical current passes through the resistive layers, a temperature distribution within the substrate will be substantially symmetrical about the central longitudinal plane of the substrate for eliminating thermal bending thereof. The splitting of the surge current between two resistive layers results in the lower temperature in each resistive layer when compared with the temperature in the single resistive layer of the prior art chip resistor loaded by the same current.

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Beer-Sheva, Israel

Michael Belman