Microsoft Technology Licensing, LLC

Michael Beerman

Roy Joseph Riccomini

Maosheng Ye

Michael Nikkhoo

Doug Heirich

Joseph Daniel Taylor

Javier Yanez

Andrew Bart Hodge

Andrew Bert Hodge

Frank C Holloway

Igor Markovsky

Brian Joseph Toleno

Simon Hodgson

Marianne E Laford

A method of making an integrated depth sensor window lens, such as for an augmented reality (AR) head set, the depth sensor window lens comprising a sensor lens and an illuminator lens separated by an opaque dam. The method uses a two-shot injection molding process, a first shot comprising an optically clear polymeric material to form the sensor lens and the illuminator lens and the second shot comprising an opaque polymeric material to form the separator of the two.

Integrated depth sensor window lens and method

A Near-Eye-Display (NED) device having a housing shell that is integrated with molded boss clusters for precision mounting of hardware components. The techniques disclosed herein include forming a housing shell directly over one or more pre-molded boss clusters that have been inserted into cavities of a housing shell mold core. For example, with the pre-molded boss clusters already inserted into the cavities, a selected housing shell material such as a thermosetting epoxy resin impregnated carbon fiber reinforced (CFRP) fabric may be thermal compression molded over the housing shell mold core. Individual ones of the pre-molded boss clusters include one or more 'three-dimensional (3D)' bosses for mounting various hardware components of the NED device. The bosses may protrude from an inner surface of the housing shell and may provide interior mounting features without affecting the appearance of the outer surface of the housing shell.

Near eye display (NED) device housing shell integrated with molded boss clusters for precision mounting of hardware components

A flexible thermal conduit runs from a first housing portion of an electronic device to a second housing portion of the electronic device, to convey heat generated by an electronic component located in the first housing portion to a heat dissipation structure located in the second housing portion, where the second housing portion is flexibly coupled to the first housing portion, for example, by a hinge or other type of joint. The flexible conduit may include a plurality of layers of thin, flat thermally conductive material, which may be arranged to flex independently of each other in the region where the first and second housing portions are coupled.

Flexible thermal conduit for an electronic device

Heat dissipation structure for an electronic device

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Mill Valley, CA, United States of America

Michael Beerman