Infineon Technologies Ag

Other

Siemens Aktiengesellschaft

Intel Mobile Communications Gmbh

Michael Bauer

Joachim Mahler

Alfred Haimerl

Angela Kessler

Wolfgang Schober

Edward Fuergut

Ludwig Heitzer

Christian Stuempfl

Peter Strobel

Jens G Pohl

Simon Jerebic

Holger Woerner

Hermann Vilsmeier

Reimund Engl

Thomas Bemmerl

Heinrich Koerner

Werner Kanert

Brigitte Ruehle

Michael Huettinger

Rainer Steiner

Robert-Christian Hagen

Daniel Porwol

Ulrich Bachmaier

Francisco Javier Santos Rodriguez

Jochen Dangelmaier

Gerald Ofner

Irmgard Escher-Poeppel

Frank Hille

Antonio Vellei

Johann Gatterbauer

Stephan Stoeckl

Bernhard Zuhr

Georg Meyer-Berg

Markus Brunnbauer

Dominic Maier

Ulrich Wachter

Kai Chong Chan

Tobias Schmidt

Heinz Pape

Markus Fink

Holger Doepke

Christian Birzer

Edward Fürgut

Rudolf Kerler

Thomas Engling

Claus Von Waechter

Wolfram Eurskens

Horst Theuss

Khalil Hosseini

Walter Hartner

Maciej Wojnowski

Bernd Goller

Horst Groeninger

Stefan Miethaner

Georg Ernst

Ottmar Geitner

Gerold Gruendler

Bernd Rakow

Holger Wörner

Angela Wieneke Kessler

Robert Christian Hagen

Andreas Stueckjuergen

Christian Stümpfl

Rabie Djemour

Herman Vilsmeier

Eric Kuerzel

Hermann Vllsmeler

A method of forming an electrical contact is provided. The method may include depositing, by atomic layer deposition, a passivation layer over at least a region of a metal surface, wherein the passivation layer may include aluminum oxide, and electrically contacting the region of the metal surface with a metal contact structure, wherein the metal contact structure may include copper.

Chip package, method of forming a chip package and method of forming an electrical contact

A method of forming an electrical contact and a method of forming a chip package are provided. The methods may include arranging a metal contact structure including a non-noble metal and electrically contacting the chip, arranging a packaging material, and a protective layer including or essentially consisting of a portion formed at an interface between a portion of the metal contact structure and the packaging material, wherein the protective layer may include a noble metal, wherein the portion of the protective layer may include a plurality of regions free from the noble metal, and wherein the regions free from the noble metal may provide an interface between the packaging material and the non-noble metal of the metal contact structure.

Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer

In various embodiments, methods for forming a chip package are provided. The chip package may include a chip comprising a chip metal surface, a metal contact structure electrically contacting the chip metal surface, a packaging material at least partially encapsulating the chip and the metal contact structure, and a chemical compound physically contacting the packaging material and at least one of the chip metal surface and the metal contact structure, wherein the chemical compound may be configured to improve an adhesion between the metal contact structure and the packaging material and/or between the chip metal surface and the packaging material, as compared with an adhesion in an arrangement without the chemical compound, wherein the chemical compound is essentially free from functional groups comprising sulfur, selenium or tellurium.

Method for forming a chip package with compounds to improve the durability and performance of metal contact structures in the chip package

A method for handling a product substrate includes bonding a carrier to the product substrate by: applying a layer of a temporary adhesive having a first coefficient of thermal expansion onto a surface of the carrier; and bonding the carrier to the product substrate using the applied temporary adhesive. A surface of the temporary adhesive is in direct contact to a surface of the product substrate. The temporary adhesive includes or is adjacent a filler material having a second coefficient of thermal expansion which is smaller than the first coefficient of thermal expansion, so that stress occurs inside the temporary adhesive layer or at an interface to the product substrate or the carrier during cooling down of the temporary adhesive layer.

Method for handling a product substrate and a bonded substrate system

In various embodiments, a chip package is provided. The chip package may include a chip comprising a chip metal surface, a metal contact structure electrically contacting the chip metal surface, a packaging material at least partially encapsulating the chip and the metal contact structure, and a chemical compound physically contacting the packaging material and at least one of the chip metal surface and the metal contact structure, wherein the chemical compound may be configured to improve an adhesion between the metal contact structure and the packaging material and/or between the chip metal surface and the packaging material, as compared with an adhesion in an arrangement without the chemical compound, wherein the chemical compound is essentially free from functional groups comprising sulfur, selenium or tellurium.

Chip package comprising a chemical compound and a method of forming a chip package comprising a chemical compound

A method for manipulating ions contained in an encapsulation material for a semiconductor device is provided. The method includes processing the encapsulation material and applying an electric field to the encapsulation material before the encapsulation material is finally cured. The ions contained in the encapsulation material have a mobility that decreases as the encapsulation material cures. By applying the electric field to the encapsulation material before the encapsulation material is finally cured, the amount of ions contained in the encapsulation material is reduced and/or the ions contained are concentrated in one or more regions of the encapsulation material. Corresponding apparatuses and semiconductor packages manufactured by the method are also described.

Ion manipulation methods and related apparatuses and systems for semiconductor encapsulation materials

In various embodiments, a chip package is provided. The chip package may include a chip, a metal contact structure including a non-noble metal and electrically contacting the chip, a packaging material, and a protective layer including or essentially consisting of a portion formed at an interface between a portion of the metal contact structure and the packaging material, wherein the protective layer may include a noble metal, wherein the portion of the protective layer may include a plurality of regions free from the noble metal, and wherein the regions free from the noble metal may provide an interface between the packaging material and the non-noble metal of the metal contact structure.

Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact

A chip package is provided, the chip package including: a chip carrier; a chip disposed over and electrically connected to a chip carrier top side; an electrically insulating material disposed over and at least partially surrounding the chip; one or more electrically conductive contact regions formed over the electrically insulating material and in electrical connection with the chip; a further electrically insulating material disposed over a chip carrier bottom side; wherein an electrically conductive contact region on the chip carrier bottom side is released from the further electrically insulating material.

Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packages

A method for handling a product substrate includes bonding a carrier to the product substrate. A layer of a permanent adhesive is applied onto a surface of the carrier. A structured intermediate layer is provided. The applied permanent adhesive bonds the carrier to the product substrate. The structured intermediate layer is arranged between the product substrate and the carrier. A surface of the structured intermediate layer and a surface of the permanent adhesive are in direct contact to a surface of the product substrate. The structured intermediate layer decreases a bonding strength between the product substrate and the carrier.

Method for handling a product substrate, a bonded substrate system and a temporary adhesive

In various embodiments, a chip package is provided. The chip package may include a chip including a chip metal surface, a metal contact structure electrically contacting the chip metal surface, and packaging material including a contact layer being in physical contact with the chip metal surface and/or with the metal contact structure; wherein at least in the contact layer of the packaging material, a summed concentration of chemically reactive sulfur, chemically reactive selenium and chemically reactive tellurium is less thanatomic parts per million.

Chip package and method of forming a chip package

A method for fabricating an electronic device includes providing a first semiconductor chip and a second semiconductor chip. The first semiconductor chip has a first semiconductor die and a first solder interconnect layer applied to a main face of the first semiconductor die. The second semiconductor chip has a second semiconductor die, an insulating layer applied to a main face of the second semiconductor die, and a second solder interconnect layer applied to the insulating layer. The method further includes attaching the first semiconductor chip with the first solder interconnect layer to a first carrier and attaching the second semiconductor chip with the second solder interconnect layer to a second carrier.

Method for attaching a semiconductor die to a carrier

A chip arrangement includes semiconductor chips coupled to opposing sides of an insulating layer. The arrangement includes a first semiconductor chip having a first chip surface presenting a first chip conductive region. An electrically insulating layer includes a first layer surface presenting a first layer conductive region, and a second, opposing surface presenting a second layer conductive region. The electrically insulating layer is coupled to the first semiconductor chip by applying the first layer conductive region to the first chip conductive region. The electrically insulating layer is then coupled to the second chip conductive region by applying the second layer conductive region to the second chip conductive region.

Chip arrangement and method for producing a chip arrangement

A method for fabricating semiconductor packages includes providing a first substrate having an aperture, providing a first semiconductor chip, connecting the first semiconductor chip to the first substrate, filling the aperture with a first insulating material and encapsulating the semiconductor chip with a second insulating material to create a first encapsulation body.

Method for fabricating a semiconductor package and semiconductor package

A semiconductor device and a method for making a semiconductor device are disclosed. In an embodiment a semiconductor device includes a semiconductor chip and a fiber reinforced encapsulation layer at least partly covering the semiconductor chip.

Method for fabricating a semiconductor device

Growing community of inventors

Nittendorf, Germany

Michael Bauer