Growing community of inventors

Boise, ID, United States of America

Michael B Ball

Average Co-Inventor Count = 1.37

ph-index = 27

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 3,038

Michael B BallRich Fogal (41 patents)Michael B BallChad A Cobbley (12 patents)Michael B BallMarjorie L Waddel (10 patents)Michael B BallTroy A Manning (4 patents)Michael B BallSteve W Heppler (4 patents)Michael B BallRonald W Ellis (4 patents)Michael B BallSteven W Heppler (2 patents)Michael B BallTom A Muntifering (2 patents)Michael B BallWilliam A Polinsky (1 patent)Michael B BallJose L Sanchez (1 patent)Michael B BallMike Bettinger (1 patent)Michael B BallMichael B Ball (131 patents)Rich FogalRich Fogal (68 patents)Chad A CobbleyChad A Cobbley (123 patents)Marjorie L WaddelMarjorie L Waddel (10 patents)Troy A ManningTroy A Manning (320 patents)Steve W HepplerSteve W Heppler (13 patents)Ronald W EllisRonald W Ellis (11 patents)Steven W HepplerSteven W Heppler (10 patents)Tom A MuntiferingTom A Muntifering (6 patents)William A PolinskyWilliam A Polinsky (6 patents)Jose L SanchezJose L Sanchez (2 patents)Mike BettingerMike Bettinger (1 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Micron Technology Incorporated (129 from 37,542 patents)

2. Micron Semiconductor, Inc. (2 from 156 patents)


131 patents:

1. 7846776 - Methods for releasably attaching sacrificial support members to microfeature workpieces and microfeature devices formed using such methods

2. 7644853 - Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux

3. 7635079 - System for locating conductive sphere utilizing screen and hopper of solder balls

4. 7371612 - Method of fabrication of stacked semiconductor devices

5. RE40061 - Multi-chip stacked devices

6. 7275676 - Apparatus for locating conductive spheres utilizing screen and hopper of solder balls

7. 7166495 - Method of fabricating a multi-die semiconductor package assembly

8. 7131568 - Methods for lead penetrating clamping system

9. 7105432 - Method of locating conductive spheres utilizing screen and hopper of solder balls

10. 6989285 - Method of fabrication of stacked semiconductor devices

11. 6981629 - Apparatus of clamping semiconductor devices using sliding finger supports

12. 6957760 - Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux

13. 6956294 - Apparatus for routing die interconnections using intermediate connection elements secured to the die face

14. 6949158 - Using backgrind wafer tape to enable wafer mounting of bumped wafers

15. 6886734 - Device and method for clamping and wire-bonding the leads of a lead frame one set at a time

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as of
9/10/2025
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