Delta Design, Inc.

Michael Anthony Laver

Kexiang Ken Ding

Samer Kabbani

Jerry Ihor Tustaniwskyj

Keith E Emery

Kenneth B Uekert

James Frandsen

Alton R Lindsey, Jr

A vision alignment system for an integrated circuit device testing handler includes a head guiding ring configured to be attached to a pick-and-place device, the head guiding ring having an opening in which a device-under-test having a device contact array is locatable; a socket apparatus including: a fixed mounting frame, a moveable socket guiding ring, and a plurality of actuators configured to move the moveable socket guiding ring relative to the fixed mounting frame; and a visualization device configured to provide data relating to a position of the device contact array relative to the contactor pin array. The socket apparatus is configured to adjust a position of the head guiding ring by moving the moveable socket guiding ring while the head guiding ring is located in an opening of the moveable socket guiding ring to align the device contact array to the contactor pin array.

Micro-vision alignment system with guiding rings for IC testing

A system for double sided integrated circuit device testing includes: (i) a picking section including: (a) a plurality of picking-section pockets; (b) a picking-section plate including: one or more picking-section pocket openings, and first and second picking-section plate pins; (ii) a placing section including: (a) a plurality of placing-section contactors; (b) a placing-section member including: one or more placing-section contactor openings, and first and second placing-section member pins; and (iii) a pick-and-place section including: (a) a pick-and-place device including: a plurality of pick-and-place head contactors, and one or more sets of actuators; and (b) a pick-and-place head plate including: one or more pick-and-place head contactor openings, each pick-and-place head contactor opening corresponding to a pick-and-place head contactor, and first and second spring-loaded bushings configured to engage with the first and second picking-section plate pins, and the first and second placing-section member pins.

Group vision alignment for double sided IC device testing

A system for detecting characteristics of a surface includes multiple sources of lights, a platform structure configured to support the surface, a lens aligned with the platform structure, a cropping aperture, and an image receiver. The platform structure is configured to receive light from the source of light and the lens is positioned such that the source of light is not in focus, but the detected surface is in focus. The cropping aperture is configured to crop light reflected from the surface, and the image receiver is configured to receive the light conditioned by the cropping aperture.

Imaging system with defocused and aperture-cropped light sources for detecting surface characteristics

A method of pick-and-place alignment comprises (a) determining a pick location of a device from a tray of devices; (b) determining place location of the device using an up-looking camera; and (c) determining offset error for the device by comparing the pick location and the place location. The method may further comprise repeating steps (a)-(c) for additional devices on the tray of devices; and generating an offset map for alignment of devices on the tray. The method further uses the offset map to make pick and place corrections during runtime.

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El Cajon, CA, United States of America

Michael Anthony Laver