Hewlett-packard Development Company, L.p.

Hewlett Packard Enterprise Development LP

Michael Alan Brooks

Thane Michael Larson

Glenn Cochran Simon

James David Hensley

Jeremy Ian Wilson

Sean Anthony Cerniglia

Bryan David Bolich

Stephen Daniel Cromwell

Kevin N Smith

Michael J Greenside

Matt Neumann

Steven R Hahn

Todd D Robertus

Shadi F Sakkab

Mike Cherniski

A disabling device includes an adhesive layer and/or a self-hardening material. The adhesive layer or self-hardening material contacts electrical contacts of an electrical interface.

Disabling device including adhesive to disable an electrical interface

A cable routing device for installation on a post of a computing system board, includes a tube shaped main body having a hollow inner cavity. The main body includes a lower generally cylindrical portion having a first inner diameter sized to achieve a clearance fit over the post, and a flexible upper portion having a general shape of a truncated cone when in an unflexed condition, the flexible upper portion having slits arranged approximately opposite to each other thereby defining two sides to the flexible upper portion, the flexible upper portion having a second inner diameter proximate to a top of the flexible upper portion. When the flexible upper portion is in the unflexed condition, the second inner diameter is smaller than the first inner diameter and smaller than an effective diameter of the post, and when the two sides are flexed in an outward direction the device achieves a clearance fit over the post. The device further includes a cable clip molded to the main body, and configured to retain a plurality of cables.

Cable routing device

A method and apparatus to mount a uniform force hydrostatic bolster plate to a substrate. One embodiment of the invention involves a method to assemble a uniform force hydrostatic bolster plate on a substrate. A second embodiment of the invention involves a method to fabricate a uniform force hydrostatic bolster plate. A third embodiment of the invention involves an assembled substrate with a uniform force hydrostatic bolster plate on the opposite side of the assembled substrate, under an electrical contact area of a component on the assembled substrate.

Uniform force hydrostatic bolster plate

Embodiments of the present invention provide an electro-magnetic suppressive structure. The electro-magnetic suppressive structure comprises a cover portion and an integrally formed conductive portion.

Electro-magnetic suppressive structure

A connection assembly permits a make first and break last connection for primary power. The assembly includes a first pair of connectors, a second pair of connectors, and a compliance element associated with one of the first pair of connectors. The compliance element enables the first pair of connectors to mate prior to the mating of the second pair of connectors and to enable the first pair of connectors to disengage after the disengagement of the second pair of connectors.

Make first break last connection assembly

A computer system includes an enclosure, a backplane within the enclosure, a replaceable unit releasably connected to the backplane, an air cooling system configured to create an air flow along the replaceable unit and an air flow blocking system. The air flow blocking system includes a first member coupled to the enclosure and a second member coupled to the replaceable unit. The first member and the second member interact to at least partially block air flow along the replaceable unit based upon at least one characteristic of the replaceable unit.

Computer cooling system and method

A computer system includes an enclosure, a forced air cooling system configured to create air flow within the enclosure, a printed circuit board and an air flow blockage member. The printed circuit board is within the enclosure and includes a plurality of connectors including a first connector and a second connector separated by a first space. The air flow blockage member is proximate the first space and is movable between at least a first open position and a second open position distinct from the first open position.

An airflow blocker component of an apparatus in one example is coupled with a support component. The airflow blocker component comprises a flexible flap portion that is bendable away from the support component into a position that directs one or more airflow portions to promote an increased cooling of one or more thermal components.

Airflow blocker component that comprises a flexible flap portion

A bladed server with a chassis having a front and rear is provided. A plurality of blades is disposed within the chassis so that opposing faces and a faceplate of each of the plurality of blades are substantially perpendicular to the front and rear of the chassis. The plurality of blades includes at least one server blade. One or more fans are located at at least one of the front and rear of the chassis such that a flow-path at at least one of an inlet and exit of the one or more fans is substantially parallel to the opposing faces and faceplate of each of the plurality of blades.

Bladed servers

A keyed filler panel with removably-coupleable airflow resistive filler card assembly is disclosed. In one embodiment, the present invention is comprised of a filler panel body. The present embodiment is further comprised of an airflow resistive filler portion removably-coupleable with said filler panel body. The airflow resistive filler portion adapted to couple with the filler panel body without additional hardware.

Keyed filler panel with removably-coupleable airflow resistive filler card assembly

The present invention provides a baffle for use with an electronic system including a wall, a first edge guide, and a second edge guide. The wall has a first edge and a second edge opposite the first. The first edge guide is connected to the wall and extends beyond the first edge of the wall. The second edge guide is connected to the wall and extends beyond the second edge of the wall. The first edge guide and the second edge guide are adapted to selectively associate with a first card guide and a second card guide of the modular electronic system. The baffle is adapted to manage airflow within the modular electronic system.

Composite construction baffle for modular electronic systems

A method and apparatus to mount a uniform force hydrostatic bolster plate to a substrate. One embodiment of the invention involves a method to assemble a uniform force hydrostatic bolster plate on a substrate.

Method to assemble a uniform force hydrostatic bolster plate

A method and apparatus to achieve an electro-mechanical interlock for a hot-swappable component. This invention prevents the misuse and possible damage to the hot-swappable component or the host data processing system due to incorrect insertion or removal of an energized hot-swappable component. One embodiment of the invention involves a method to assemble a hot-swappable power supply with an electro-mechanical interlock into the frame of a data processing system. A second embodiment of the invention involves a method to fabricate an electro-mechanical interlock with a solenoid. A third embodiment of the invention involves a hot-swappable component interlock.

Electro-mechanical interlock for hot-swappable power supplies and cards

An apparatus in one example comprises a first card guide base portion and a card guide end portion. The first card guide base portion is connected with a second card guide base portion in a side-by-side relationship. The card guide end portion is employable with the first card guide base portion to comprise one or more portions of a card guide path. The card guide end portion comprises a face of a color that is different from a color of the first card guide base portion.

Growing community of inventors

Sacramento, CA, United States of America

Michael Alan Brooks