Intel Corporation

Michael Ahrens

David Pidwerbecki

Bo Qiu

George H Daskalakis

Steven Lofland

James Raupp

Stacy L Yee

Mark Angus MacDonald

Aleksander Magi

Russell S Aoki

Xi Guo

Roger Viet

Particular embodiments described herein provide for an electronic device that includes a flexible display and a support for the flexible display. The support includes a main support structure, at least one curve crease, and a curve region, wherein the curve region includes a curve support.

Flexible display structure

In one example an electronic device comprises a chassis, a processing device disposed in the chassis, a first heat spreader positioned adjacent the processing device and in thermal communication with the processing device, and a second heat spreader positioned adjacent the first heat spreader and in thermal communication with the first heat spreader. In some examples the second heat spreader is moveable between a first position in which the second heat spreader is disposed within the chassis and a second position in which at least a portion of the second heat spreader extends outside the chassis. Other examples may be described.

Retractable heat exchanger

Apparatuses, systems and methods associated with flexible heat spreader design are disclosed herein. In embodiments, an electronic device may include a component, a heat dissipation member, and a flexible member. The heat dissipation member may be coupled to the component via a flexible portion of the electronic device, the component located on a first side of the flexible portion and the heat dissipation member located on a second side of the flexible portion. The flexible member may be thermally coupled to the component and the heat dissipation member, wherein the flexible member extends along the flexible portion from the first side to the second side and is to transfer heat from the component to the heat dissipation member. Other embodiments may be described and/or claimed.

Flexible heat spreader

Systems, methods and apparatuses may provide for a flexible display assembly including a flexible display and a backplane coupled to the flexible display, wherein at least a portion of the backplane comprises a super elastic sheet. In one example, the backplane includes a first rigid sheet metal portion and a second rigid sheet metal portion, wherein the super-elastic sheet is joined between the first and second rigid sheet metal portions.

Super-elastic hinge for flexible display

According to embodiments of the present invention, an optical transponder module generates heat when operating and a heat pipe disposed in the module body performs active heat transfer from a hot end of the optical transponder module to a cooler end of the optical transponder module. A heat pipe disposed in an external clip-in heat sink may remove heat from the optical transponder body.

Optical transponder with active heat transfer

According to one embodiment of the invention, a system comprising a housing including an opening to receive an optical connector, and an electromagnetic inductive (EMI) shield independent of the optical connector to cover a portion of the opening to reduce emissions of EMI radiation generated by the optical connector from the transceiver housing. According to another embodiment of the invention, a method comprising connecting an optical connecter to an optical port of a housing in an optical module, the housing comprising an opening to receive to the optical connector; and shielding a portion of an opening in the housing to reduce emissions of EMI radiation generated by the optical connector from the housing.

Electromagnetic inductive shield

According to embodiments of the present invention, an optical transponder module generates heat when operating and at least a copper heat wick and/or a copper block are disposed in the module body to perform passive transfer of heat from inside the optical transponder module to outside the optical transponder module. The heat wick may be soldered to thermal vias in the printed circuit board that is internal to the optical transponder module and positioned over the laser transmitter circuitry. The copper block may be positioned in a cutout in the optical transponder module body to acts as a heat spreader. Thermal grease, compounds, paste, interface material, etc., may be used to help the conduction of heat.

Growing community of inventors

San Jose, CA, United States of America

Michael Ahrens