Intel Corporation

Illumina Corporation

Arizona State University

Michael Aaron Schroeder

Robert C Kain

Dale Buermann

Mark T Reed

David Louis Heiner

Michal Lebl

Matthew William Hage

Kamil Salloum

Bryan Crane

Jonathan Posner

Carl L Deppisch

Manish Dubey

Atul N Hatalkar

Rajen S Sidhu

Kelly P Lofgreen

Joseph B Petrini

Erich Nolan Ewy

Syadwad Jain

Patrick Nardi

Zhizhong Tang

Wei Hu

Shankar Devansenathipathy

Ali Moradi

Stephen Andrew Langanke

Embodiments include apparatuses, systems and methods for a computer device with a casing and a substance in the casing substantially surrounding a computer component in the casing. In embodiments, the computer device may be a command and control computer, such as for example, an autonomous or semi-autonomous vehicle. In embodiments, the substance may be an electrically isolative and shear-thickening fluid to provide thermo-mechanical protection to a computer component. In the described embodiments, the substance may dampen mechanical shock or vibrational impact on the processor and the memory. The shear-thickening gel may further be thermally conductive in embodiments. In the embodiments, the casing may be substantially filled with the substance and the substance is to conduct heat away from the processor and the memory toward an outer edge of the casing. Other embodiments may also be described and claimed.

Apparatuses, methods, and systems for thermomechanical protection of electronics including computer components and sensors

Particular embodiments described herein provide for an electronic device that can be configured to include a printed circuit board, where the printed circuit board has a first side and an opposite second side, a heat source located on the first side of the printed circuit board, a heatsink over the heat source, and one or more fasteners coupled to the heatsink. The one or more fasteners go through the printed circuit board and each of the one or more fasteners includes a printed circuit board securing area that extends along the second side of the printed circuit board to help secure the heatsink to the printed circuit board and create an applied load on the heat source. In an example, a thermal interface material layer less than about one hundred (100) micrometers in in thickness can be between the heat source and the heatsink.

Heatsink secured to a heat source

In one aspect, an apparatus comprises a first housing and a second housing. The first housing comprises a surface to receive heat from a heat-generating component. The second housing comprising a receptacle in which to receive the first housing. The first housing is to nest within the receptacle. The receptacle inhibits movement of the first housing along a first axis and facilitates movement of the first housing along a second axis. The first housing is moveable within the receptacle along the second axis. Movement of the first housing along the second axis changes a size of a gap between the surface and the heat-generating component.

Modular heat transfer system

Devices and methods disclosed herein can include a conductive foam having pores disposed within the conductive foam. The conductive foam can be compressible between an uncompressed thickness and a compressed thickness. The compressed thickness can be ninety-five percent or less of the uncompressed thickness. In one example, a filler can be disposed in the pores of the conductive foam. The filler can include a first thermal conductivity. The first thermal conductivity can be greater than a thermal conductivity of air.

Foam composite

An electroosmotic (EO) pump is provided that includes a housing having a pump cavity, a porous core medium and electrodes. The porous core medium is positioned within the pump cavity to form an exterior reservoir that extends at least partially about an exterior surface of the porous core medium. The porous core medium has an open inner chamber provided therein. The inner chamber represents an interior reservoir. The electrodes are positioned in the inner chamber and are positioned proximate the exterior surface. The electrodes induce flow of a fluid through the porous core medium between the interior and exterior reservoirs, wherein a gas is generated when the electrodes induce flow of the fluid. The housing has a fluid inlet to convey the fluid to one of the interior reservoir and the exterior reservoir. The housing has a fluid outlet to discharge the fluid from another of the interior reservoir and the exterior reservoir. The housing has a gas removal device to remove the gas from the pump cavity.

System or device for biochemical analysis having at least one electroosmotic pump

An apparatus for fragmenting nucleic acid. The apparatus includes a sample reservoir that comprises a fluid having nucleic acids. The apparatus can also include a shear wall that is positioned within the sample reservoir. The shear wall includes a porous core medium that has pores that are sized to permit nucleic acids to flow therethrough. The apparatus also includes first and second chambers that are separated by the shear wall. The first and second chambers are in fluid communication with each other through the porous core medium of the shear wall. Also, the apparatus may include first and second electrodes that are located within the first and second chambers, respectively. The first and second electrodes are configured to generate an electric field that induces a flow of the sample fluid. The nucleic acids move through the shear wall thereby fragmenting the nucleic acids.

Apparatus for fragmenting nucleic acids

Growing community of inventors

Chandler, AZ, United States of America

Michael Aaron Schroeder