Flowcardia, Inc.

Delaware Capital Formation, Inc.

Hover-davis, Inc.

Nooma Bio, Inc.

Ui Holding Company

Michael A Summers

Jeff Sarge

Peter Gregory Davis

William Dunbar

Dean Albert Tarrant

Eric Thorne

Reto Stamm

A method of recanalizing a lumen of a vessel includes positioning an ultrasonic device having a distal end in a first position within the lumen of the vessel; transmitting pulsed ultrasonic vibrations though the ultrasonic device to the distal end; and advancing the distal end through the lumen to recanalize the vessel.

Ultrasound catheter system

Two-pore devices and method for sequencing are described. A two-pore device can include first chamber, a second chamber, and a third chamber, wherein the first chamber is in communication with the second chamber through a first nanopore, and wherein the second chamber is in communication with the third chamber through a second nanopore. The device can also include sensing circuitry for measuring electrical signals associated with a target at a nanopore, and control circuitry for controlling motion of the target at a nanopore. The device can include and/or switch between sensing and control modes for each of the first nanopore and the second nanopore. Sequencing methods can implement a two-pore device in relation to translocation of a target through one or more nanopores, switching between sensing and control modes as appropriate, and measuring aspects of the target using in sensing modes.

Dual pore&#x2014;control and sensor device

An ultrasonic system operable at high drive frequencies and/or in pulsed operation is disclosed. The system may be used in a procedure to treat an occluded blood vessel. The system can be used to transmit ultrasonic energy from an ultrasonic transducer to a distal end of an ultrasonic transmission device. The ultrasonic device may operate at a resonant frequency. The resonant frequency can be determined prior to using the device and/or during use. The ultrasonic device may operate in a range of frequencies at or near resonance. Operational parameters including, for example, reflected vibrations, temperature, and/or user input can be used by the system to adjust the driving waveform.

Provided is a component tape feeder apparatus comprising a single output module, a single component exposure module, operably connected to the single output module, and, a plurality of input modules, wherein each input module of the plurality of input modules is operably connected to the single exposure module. A corresponding method of feeding electronic components includes supplying a plurality of component tapes housing electronic components to the single exposure module, wherein the supplying involves receiving and forwarding of the plurality of component tapes by the plurality of input modules.

Component tape feeder

A method for the co-processing of bare die removal from a semiconductor wafer for the improved throughput of the extraction of die from a wafer for subsequent placement onto a substrate. The apparatus includes a pick head containing a nozzle having a suction port within that secures the bare die as it is removed from the wafer. The intermediate holding station has a plurality of nozzles, each having a vacuum port to secure and buffer a multitude of flipped die that are transferred from the pick nozzle. Vacuum flow valves enable the release and transfer of the bare die. Having a multiple of nozzles provides a buffer for the die as they are subsequently transitioned from the pick nozzle, queued within the intermediate transfer station and loaded in tandem onto a die shuttle.

Growing community of inventors

Santa Cruz, CA, United States of America

Michael A Summers