Honeywell International Inc.

Rexam Beverage Can Company

Isola Laminate Systems Corporation

Michael A Petti

James T Yardley

Chengzeng Xu

Gordon C Smith

David R Haas

Jeffrey T Gotro

Michael Vallance

A metallic can end for a container is described. The metallic can end has a curl defining an outer perimeter of the can end. A wall extends downwardly from the curl. A strengthening member is joined to a lowermost end of the wall. A center panel is joined to the strengthening member and is centered about a longitudinal axis. The center panel has a product side and a public side. A rivet is located on the center panel. A displaceable tear panel is on the center panel. The tear panel is at least substantially defined by a frangible score and a non frangible hinge segment. A non-detachable tab is staked to the center panel by the rivet. The non-detachable tab has a nose end extending over a portion of the tear panel, a lift end opposite the nose end, and a central webbing between the nose and lift end. The webbing has a hinge region and a rivet island surrounding the rivet. The rivet island is at least partially surrounded by a first void region to provide a first exposed area of the center panel. A first temperature indicator has a first thermochromic material which undergoes a color change upon reaching a first predetermined temperature. The first temperature indicator is located on the non-detachable tab.

And temperature indicating can ends and tabs

A metal-clad laminate product including a carrier film, a release agent layer, a semi-transparent metal layer and a photo dielectric layer deposited on the conductive metal layer and a method for using the metal-clad laminate product to form an interlayer via by exposing at least a portion of an circuit board intermediate prepared from the metal-clad laminate product to light through the semi-transparent metal layer for a period of time sufficient to form an exposed or an unexposed photo dielectric portion and thereafter removing the exposed or unexposed portion of the photo dielectric layer and a corresponding portion of the semi-transparent metal layer overlying the exposed or unexposed portion of the photo dielectric layer to form an interlayer via.

Method of manufacturing an interlayer via and a laminate precursor useful for same

High density built-up multilayer printed circuit boards are produced by constructing microvias with photoimageable dielectric materials. A photosensitive dielectric composition on a conductive foil is laminated to conductive lines on a core. After imaging the foil and imaging and curing the photosensitive dielectric composition, vias are formed to the conductive lines. Thereafter the conductive lines are connected through the vias to the conductive foil, and then the conductive foil is patterned.

Fabrication of high density multilayer interconnect printed circuit boards

Growing community of inventors

Buffalo Grove, IL, United States of America

Michael A Petti