Microelectronics and Computer Technology Corporation

Other

Michael A Olla

Seyed H Hashemi

Thomas P Dolbear

Daniel M Andrews

Kenneth C Noddings

Richard D Nelson

Thomas Alan Bishop

John C Parker

Howard A Moore

Jason J Yu

Charles L Spooner

Thomas J Hirsch

Robert C Gardner

Colin A MacKay

A method of forming a waveguide or an optical assembly includes molding a waveguide material, optionally in alignment with one or more optical components. The one or more optical components are aligned in a precision mold that is also used to form the waveguide. A cladding and encapsulation material can also be molded. The molded materials can be used to hold the components together in alignment in a single assembly. A connector structure can be molded as part of the assembly or can be prefabricated and incorporated into the molded assembly to facilitate connecting the assembly to other components without requiring active alignment or polishing of optical fiber ends.

Fabrication of optical devices and assemblies

An assembly of an optical interconnect module adaptable for mating with an optical connector having at least one optical fiber and an alignment pin. A method of assembly includes the steps of (1) mounting an optical device onto a connector body, wherein the connector body is a portion of the optical interconnect module, and wherein the optical device is operable for transmitting or receiving optical signals to/from the optical fiber, (2) inputting a relative position between the alignment pin and an end of the optical fiber, (3) and forming a slot in the connector body by using the measured relative position between the alignment pin and the end of the optical fiber, wherein a relative position between the slot and the optical transceiver mirrors the relative position between the alignment pin and the end of the optical fiber so that the optical device and the end of the optical fiber are substantially aligned to permit transmission of the optical signals when the optical connector and the optical interconnect module are mated, wherein the slot is adaptable for receiving the alignment pin.

Parallel optical transceiver link

Multicell system and method for making a multicell system. Systems include relatively thin (less than about 50 mil) electrochemical cells layered upon one another to minimize volume and weight. Cells systems are formed with cells that are layered such that first charge sides of each cell are coupled to first charge sides of other cells, and such that second charge sides of each cell are coupled to second charge sides of other cells. Cells and/or cell systems is connected to other cells and/or cell systems to form battery systems by layering cells such that a first charge side of a cell are coupled to second charge side of another cell. In this manner the number of electrically insulating separators is reduced, thereby also reducing weight and volume of resulting systems.

Thin cell electrochemical battery system; and method of interconnecting

A process for manufacturing a pin grid array package providing a plurality of electrical input and/or output connections using a plurality of stacked, but spaced apart, separate leadframes which are preformed and include a plurality of electrical leads having first and second ends for providing a plurality of different connections. An insulating layer is positioned between adjacent leadframes and the package is bonded together.

Process for manufacturing a stacked multiple leadframe semiconductor

A process for making thermosetting or thermoplastic encapsulated integrated circuit having a heat exchanger in which one end of the heat exchanger is encapsulated in the housing adjacent to the integrated circuit and the other end is exposed to the environment beyond the housing portion. The process of making includes molding a heat exchanger into a thermosetting or thermoplastic package utilizing a preformed heat exchanger having a dissolvable or removable material which serves as a seal block during the molding operation. A plurality of thermally conductive heat exchanger elements are provided for providing the desired thermal performance while reducing the thermal stresses in the package.

Method for encapsulating an integrated circuit using a removable

An encapsulated integrated circuit package having an integrated circuit chip with a plurality of electrical leads connected thereto and at least one thermally conductive screen mesh positioned adjacent to the chip. A non-electrically conductive thermosetting or thermoplastic material forms a housing enclosing the chip and bonded to the screen mesh. Preferably one of the layers is exposed to the outside of the housing and the screen mesh is secured to a substrate supporting the chip.

Thermally conductive screen mesh for encapsulated integrated circuit

An integrated circuit structure and method of making in which the circuit has a plurality of metal heat exchanger elements spaced from each other with their first ends secured to the structure. The first ends may be adhesively secured to an integrated circuit chip or the underlying substrate, and the heat exchanger may be hermetically attached. The method uses a compliant removable support block for attaching the plurality of individual heat exchanger elements to integrated circuit structures having variations in their elevation.

Integrated circuit structure with heat exchanger elements secured

A testing and burn in socket compatible with the high density test pads located at small pitches devices on a TAB tape. A TAB tape carrier for supporting the TAB tape and a test circuit board having contact pads for electrical communication with the test pads. An alignment fixture positioned between the tape carrier and circuit board and including an opening in alignment between the test pads and the contact pads. A metal in elastomer matrix is positioned in the opening for providing electrical communication between the test pads and the contact pads. A block may be positoned in the openings and contain a plurality of straight parallel electrically conductive pins aligned with the matrix for high frequency tests.

Testing socket for tab tape

Slide forming tape-automated-bonded leads extending from an integrated circuit chip with a support ring on the leads between the outer periphery of the chip and the outer lead ends. After the leads are formed the support ring remains attached to the vertical portion of the leads opposite the chip. The present invention is well suited for minimizing and footprint on relatively long TAB leads which fan out and require a support ring to maintain proper lead pitch.

Method of forming flexible metal leads on integrated circuits

An encapsulated integrated circuit which includes an integrated circuit die having a plurality of electric leads extending from the die. A thermal heat sink is positioned adjacent the die. The heat sink includes a thermoplastic material having a plurality of thermoconductive particles molded therein. A non-electrically conductive plastic material is sealably connected to the heat sink and encloses the die and seals around the leads. The heat sink plastic material is filled approximately 50 percent with metal particles, preferably in the form of powder. The particles may be from a group consisting of copper, aluminum, iron, carbon, aluminum nitride, silicon carbide, and boron nitride. The heat sink and the non-conductive plastic material have coacting interlocking interfaces.

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Austin, TX, United States of America

Michael A Olla