National Semiconductor Corporation

Michael A Millerick

Michael W Patterson

Boris Levit

An automatic laser trimming apparatus (30) for semiconductor integrated chip packages removes dambars (16) and performs deflashing and degating operations. The apparatus combines a laser machining subsystem (32, 36) with a machine vision subsystem (38, 40) to accurately locate and treat the dambars on an integrated circuit package. A defocusing lens (54) is used to attenuate the intensity of the laser beam (34) to permit a single laser to perform both the dambar removal and deflashing operations. In addition, an improved fixture (46) is provided to enhance the removal of smoke and debris from the processing station and to provide improved backlighting thereby enhancing resolution.

Laser trimming system for semiconductor integrated circuit chip packages

An automatic laser trimming apparatus (30) for semiconductor integrated chip packages removes dambars (16) and performs deflashing and degating operations. The apparatus combines a laser machining subsystem (32, 36) with a machine vision subsystem (38, 40) to accurately locate the treat and dambars on an integrated circuit package. A defocusing lens (54) is used to attenuate the intensity of the laser beam (34) to permit a single laser to perform both the dambar removal and deflashing operations. In addition, an improved fixture (46) is provided to enhance the removal of smoke and debris from the processing station and to provide improved backlighting thereby enhancing resolution.

An electrolytic apparatus and a material handling apparatus, including a pair of drive chains oriented to rotate in a substantially vertical plane. One or more product carriers, each including a basket portion, are supported by the chains. As the chains rotate, the product carriers are translated along a path in a substantially vertical plane. One tier of treatment tanks, or two tiers of vertically separated treatment tanks, may be positioned below the drive chains. Workpieces, such as encapsulated electronic components, may be placed within the baskets and translated by the drive chains for sequential immersion in each tank. Sprocket arrays engaged with each drive chain at positions above each tank direct the baskets first upward and then downward over the tank end walls, or over any barriers between the tanks.

Electrolytic apparatus with unequal legged basket-carrier

A material handling apparatus, including a pair of drive chains (each configured as a continuous loop oriented in a substantially vertical plane), and one or more rigid members are attached between the chains. A product carrier is supported by each rigid member, and a product (which may include one or more integrated circuit leadframes) rests in each carrier. As the chains simultaneously rotate at the same rotational speed, they translate each member, carrier, and product along a carrier path in a substantially vertical plane. One or more nozzle arrays (each comprising one or more nozzles) are positioned along the carrier path, preferably above the drive chains. Barriers are preferably positioned between the drive chains and selected ones of the nozzles to prevent exposure of the drive chains to some or all of the jets from the nozzles (and especially to abrasive, corrosive, or otherwise harsh jets such as deflashing slurry jets). The carriers are preferably shaped and dimensioned so that products of various types, shapes, and sizes may be placed therein. The carriers are preferably perforated to allow drainage of the jet material. In one preferred embodiment, means are provided for flipping each product at one or more desired locations along the carrier path. For example, the flipping means may serve to expose a second face of the product to a second nozzle array at a second treatment station along the carrier path, after a first face of the product has been exposed to a first nozzle array at a first treatment station along the carrier path.

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San Jose, CA, United States of America

Michael A Millerick