Texas Instruments Corporation

Michael A Mignardi

Richard O Gale, Jr

Rafael C Alfaro

Brooks J Story

Jeffrey Brian Sampsell

Richard Lee Knipe

James D Huffman

Wei-Yan Shih

Walter Marvin Duncan

John David Jackson

Lawrence D Dyer

Mark Henry Strumpell

Robert G McKenna

R Mark Boysel

Brett A Mangrum

Mark F Reed

Laurinda W Ng

Thomas J Meyer

Ronald S Croff

The disclosure in one aspect provides an illuminator that includes a plurality of segmented diodes to generate a plurality of light beams. In another aspect, the illuminator may independently control current to some or all of the diodes.

Solid-state illuminator for display applications

A system and method of providing a micromirror pixelthat is highly resistant to bright failure states. The micromirroruses an asymmetric yoketo ensure the mirror is only attracted to the address electrode in one rotation direction. The landing mechanism on the other side of the torsion binge axis also is altered to allow the pixel to over rotate in the 'off' direction. The over rotation ensures that light reflected by the mirror when in the off direction will miss the projection lens pupil, allowing the corresponding pixel to remain dark in both an operational and failed state.

Split beam micromirror

A micromechanical device (50) with spring tips (60) and its method of manufacture. A micromechanical device (50) is formed such that there is a deflectable element (36) suspended by at least one hinge (24a) over an air gap, at the bottom of which are landing stops (34a). The element (36) deflects on said hinge and comes into contact with the landing stops (34a) via at least one small metal protrusion (60), or spring tip. The spring tip flexes upon contact allowing more even distribution of forces and less wear and adhesion. The spring tips are formed in standard semiconductor processing steps with the addition of patterning the metal layer (64) from which the hinges are formed to create separated metal elements. When the deflectable element is formed, the metal forming that element bonds to the separated metal elements at the tips, thereby forming the spring tips.

Micromechanical devices with spring tips

A processing fixture and method of fabricating micromechanical devices, such as digital micromirror devices, that allows fragile structures on wafer 22 to be protected from debris during the saw operation and subsequent cleaning operations. The wafer 22 is attached to a vacuum fixture 26 after partially sawing the wafer 22 to create saw kerfs. The backside of the wafer 22 is then ground down to the saw kerfs 24 to separate the devices 32. Each device 32 is held on the fixture by a vacuum in the headspace above the device 32. In an alternate embodiment the devices are separated by sawing completely through the wafer while in the fixture.

Method of protecting micromechanical devices during wafer separation

A method of separating wafers, such as those used for semiconductor device manufacture, into die. A partly fabricated wafer is covered with a protective coating over its top surface (10). The wafer is then inscribed to define separation lines between die, with the separation lines being of a predetermined depth (12). The protective coating is then removed (14), and at least one processing step is performed at the wafer level (15, 22-24), before the inscribed wafer is separated into die. Then, the wafer is separated into die along the separation lines (17).

Separation of wafer into die with wafer-level processing

A process for partially sawing the streets on semiconductor wafers. After sawing the streets can be covered by a protective material, and then the wafer continues its processing as before. After the wafer is broken, the protective material may or may not be removed. Additionally, the wafer may be broken into individual chips using a wedge piece that has a number of individual wedges on it, where the individual wedges press against the partially sawn streets, causing the wafer to break.

Wafer method for breaking a semiconductor

A deformable mirror device comprises a plurality of groups of colored mirrors responsive to electronic signals. Each group of mirrors is coated with a mixture of resist and dye thereby reflecting specified wavelengths of visible light.

Deformable mirror device with integral color filter

Wafer-like processing after sawing DMDs

Integrated partial sawing process

A method for processing a wafer containing microelectronic mechanical devices that allows all fabrication and test steps to be performed in wafer form instead of device form. The water 20 is mounted in a saw frame 24 on dicing tape 22 and the individual devices 27 separated, typically by sawing, prior to completing device fabrication. The devices are left on the dicing tape during the remaining fabrication steps. Some fabrication steps may require covering the adhesive of the dicing tape with a protective cover 44. After all fabrication steps including the application of a protective overcoat and functional testing are completed, the devices are removed from the dicing tape and packaged.

Use of a saw frame with tape as a substrate carrier for wafer level

A deformable mirror device comprises a plurality of groups of colored mirrors responsive to electronic signals. Each group of mirrors is coated with a mixture of resist and dye thereby reflecting specified wavelengths of visible light. A process for manufacturing such a color deformable mirror device ('DMD') includes forming a layer of material on the DMD comprising a resist and a dye and selectively removing portions of the layer of material from the DMD.

Method for manufacturing a color filter for deformable mirror device

There is disclosed a device that consists of a micro-mechanical switch consisting of an electrode, a gap between the electrode and an individually deflectable element, which has a vertical shutter attached to its underside. When the electrode is addressed the movement of the deflectable element causes the shutter to raise or lower. Such a device can be used in switching. One embodiment of such a use in waveguides is disclosed along with the method of manufacture.

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Dallas, TX, United States of America

Michael A Mignardi