Pchem Associates, Inc.

Dowa Electronics Materials Co., Ltd.

Michael A Mastropietro

Gregory A Jablonski

Kimitaka Sato

Hidefumi Fujita

Hiromasa Miyoshi

Christopher J Wargo

A silver conductive film is formed on a substrate in a continuous roll-to-roll system by applying a fine silver particle dispersing solution, which contains 30 to 70 wt % of fine silver particles dispersed in a water based dispersing medium, to a halide, such as a chlorine compound, which is applied to the substrate, by flexographic printing, and thereafter, heating the substrate at 60 to 200&#xb0; C. for 0.1 to 5 seconds in an infrared (IR) heating open, which is installed on the printing path, to carry out calcination.

Method for producing silver conductive film

A silver nanoparticle composition is provided which is possible to be sintered through sintering at a low temperature in a short time and to form silver electro conductive film and wiring which is favorable for adhesion to a substrate and low in resistance, and articles using the same are provided. The silver nanoparticle composition is provided, wherein a main component of a solvent is water, a pH of the composition is within a range of 5.3 to 8.0, a silver nanoparticle included in the composition is protected by an organic acid or a derivative thereof, and the content of the organic acid or the derivative thereof with respect to silver is 2 to 20% by mass.

Low-temperature sintered silver nanoparticle composition and electronic articles formed using the same

An analytical substrate for amplifying Raman signals by a factor greater than 10,000, or by a factor less than 1,000,000. The analytical substrate is fabricated by depositing a film on the substrate and heating the substrate to a temperature less than 100 degrees Celsius for a period of time less than 30 seconds. The film can comprise a metallic nanoparticle dispersion that can further comprise a population of metallic nanoparticles. In some instances, the metallic nanoparticles have an average cross-sectional dimension in a range of about 1 nm to about 100 nm. In other instances each nanoparticle comprises at least one ligand bound to a surface of the nanoparticle, where the ligand comprises a heteroatom head group bound to the nanoparticle surface and a tail bound to the heteroatom head group.

Methods for fabricating analytical substrates using metallic nanoparticles

A process is described for the synthesis of metallic nanoparticles by chemical reduction of metal salts in the presence of organic ligands capable of binding to the metal particle surfaces and stabilizing them against agglomeration. The resultant nanoparticles or dispersions of the particles can be sintered into highly conductive films or traces at temperatures as low as 80&#xb0; C. in 10 minutes or less.

Synthesis of metallic nanoparticle dispersions capable of sintering at low temperatures

Disclosed are cohesive metallic structures, comprising sintered metallic nanoparticles, suitable for shielding against electromagnetic interference and radio frequency interference. Also disclosed are methods for forming such structures. Devices for shielding electromagnetic radiation and methods of shielding electromagnetic radiation using such devices are also provided.

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Bridgewater, NJ, United States of America

Michael A Mastropietro