Delphi Technologies, Inc.

Other

Delco Electronics Corporation

Michael A Jeter

Ralph S Taylor

Erich William Gerbsch

Jeffrey J Ronning

Roger A Mock

Andrew R Hayes

Joseph S Capurso

Erich W Gerbsch

A high-density pass-through filter apparatus slips over the terminal blade of a standard pass-through electrical connector within an opening in the bulkhead of an electronic module to which the connector is fastened. The filter apparatus retains a large number of axially oriented and axially terminated capacitive filter components which are electrically coupled at one end to the connector terminal and at the other end to a peripheral ring that resiliently engages the periphery of the bulkhead opening.

High-density pass-through filter apparatus

An electronics assembly is provided having a substrate and at least one electronics package supported on the substrate. The electronics package also has electrical circuitry and first and second side surfaces. The assembly further includes a first heat sink device positioned in thermal communication with the first side surface of the electronics package, and a second heat sink device positioned in thermal communication with the second side surface of the electronics package.

Electronics assembly having multiple side cooling and method

A drinking cup having a spill proof lid and a container. The lid fits to the container. The container has a place to write information, such as a medication dosage. The container also scaled gradations to determine the volume of fluid in the container.

Container for dispensing a liquid and method of using the same

A power electronics module includes a heat sink and an electronic package having a first layer in direct thermal communication with the heat sink. At least one electronic component is disposed between the first layer and a second layer. A thermally conductive element is in direct thermal communication with the second layer and carries heat from a first portion of the second layer to a second portion of the second layer such that the heat is transferred from the second portion of the second layer to the heat sink through the first layer.

High power electronic package with enhanced cooling characteristics

An electronics assembly is provided, including a housing and at least one electronic power device positioned within. A heat sink device is positioned within the housing and is in thermal communication with the electronic power device . The heat sink device includes a fluid vessel , a fluid input port , a fluid output port , and at least one fin insert brazed into the fluid vessel . The heat sink device is in fluid communication with an automotive radiator such that coolant flows from the automotive radiator through the fluid vessel thereby cooling the electronic power device

Automotive electronics heat exchanger

An electrical interconnection lead pattern for connecting an integrated circuit to an electrical circuit comprises a plurality of electrical conductors and a plurality of non-continuous dielectric regions. Each conductor has a contact region wherein the conductor is subsequently electrically connected to a predetermined region on the integrated circuit. In addition, each of the contact regions are substantially parallel with respect to each and every other contact region. The dielectric regions comprise a material not amenable to soldering and are substantially parallel with respect to each and every other dielectric region so that the non-continuous regions between the dielectric regions are also substantially parallel. Lastly, the contact regions are substantially perpendicular with respect to each and every dielectric region, and disposed such that a portion of each of the contact regions contacts a portion of the non-continuous region between the dielectric regions and a portion of the dielectric region. This conductor pattern provides a high tolerance for misalignment between the contact regions, the dielectric regions, and the contacted regions of the integrated circuit without detrimental effects to the integrity of the resulting electrical connection.

Growing community of inventors

Kokomo, IN, United States of America

Michael A Jeter