Corporation for National Research Initiatives

Other

Science Research Laboratory, Inc.

Corporation for National Research Iniatives

Corporation for National Reseach Initiatives

Michael A Huff

Mehmet Ozgur

Michael Pedersen

Paul Sunal

Lance Oh

Jonah H Jacob

Allen M Flusberg

A microfluidic device or system and method of manufacture is disclosed wherein a the microfluidic device or system is made from individually processed and patterned layers of LTCC green tape, that is aligned and stacked, and then co-fired to form a LTCC ceramic modules. Subsequently, microfluidic device die and/or integrated circuit device die are bonded to pre-determined areas of the modules and micro-mechanical and/or micro-electro-mechanical devices and/or systems are fabricated into or onto the surfaces of the modules. The modules are aligned bonded together to form the microfluidic devices and systems. The use of LTCC materials and techniques provides a low-cost flexible and easily customizable approach for microfluidic devices and systems that can be designed and transitioned into production with significant development time and cost.

Low-cost microfluidic devices and systems and method of manufacturing

A method and system for controlling the state of stress in deposited thin films are disclosed. According to the method and system, various process parameters, including: process pressure; substrate temperature; deposition rate; and ion-beam energies (controlled via the ion beam current, voltage, signal frequency and duty cycle) are varied using a step-by-step methodology to arrive at a pre-determined desired state of stress in thin films deposited using PVD. The method may be expressed as a computer algorithm, whereby the step-by-step procedure to obtain a pre-determined stress state, is coded for more efficient development and control of deposition processes. Alternatively, a closed-loop controlled PVD deposition system allows a pre-determined stress state of a thin film to be obtained quickly and efficiency using a feedback loop, algorithm and one or more sensors to monitor the substrate thin film stress and various process tool parameters.

Method and system for controlling the state of stress in deposited thin films

A microsensor module includes: one or more microsensors; a power supply; communication circuit; and processing circuitry. The processing circuitry may be configured to: receive data measured by the one or more microsensors; process the measured data to determine a plurality of different performance parameters related to technique of an athlete when performing a sport; and output, using the communication circuit, real-time information about the correctness of technique and performance level of the athlete performing the sport, wherein the microsensor module is encapsulated in a water-proof package that is attachable or adjoinable to the athlete's body.

Microsensors applied to athletes bodies in order to provide real-time feedback about sport-specific technique for sport performance improvements

An integrated microfluidic systems and the method of fabrication is disclosed wherein various microfluidic devices fabricated onto substrates are bonded together either using an intermediary layer or not to facilitate the bonding process. The microfluidic ports on the microfluidic devices are aligned prior to bonding and the bonding results in leak-proof seals between the devices. Moreover, the fluidic capacitance using the present invention is eliminated thereby enabling microfluidic systems with far faster time responses. The example embodiments have a wide range of applications including medical, industrial control, aerospace, automotive, consumer electronics and products, as well as any application(s) requiring the use of multiple microfluidic devices.

Integrated microfluidic system and method of fabrication

A method for depositing, patterning and removing a layer of aluminum oxide as a masking material layer for performing a deep, high-aspect ratio etches into a substrate. The method comprising deposing a photoresist onto the substrate, performing lithography processing on the photoresist, developing the photoresist to pattern the photoresist into a mask design, depositing a thin-film layer of aluminum oxide; immersing the substrate into a solution to lift-off the aluminum oxide in regions where the aluminum oxide is deposited on top of the photoresist thereby leaving the patterned aluminum oxide layer on the substrate where no photoresist was present, performing deep reactive ion etching on the substrate wherein the hard masking material layer composed of aluminum oxide functions as a protective masking layer on the substrate to prevent etching from occurring where the aluminum oxide is present, and removing the aluminum oxide masking layer by immersion in a solution.

Low-cost method of making a hard mask for high resolution and low dimensional variations for the fabrication and manufacturing of micro- and nano-devices and -systems

A method for the etching of deep, high-aspect ratio features into silicon carbide (SiC), gallium nitride (GaN) and similar materials using an Inductively-Coupled Plasma (ICP) etch process technology is described. This technology can also be used to etch features in silicon carbide and gallium nitride having near vertical sidewalls. The disclosed method has application in the fabrication of electronics, microelectronics, power electronics, Monolithic Microwave Integrated Circuits (MMICs), high-voltage electronics, high-temperature electronics, high-power electronics, Light-Emitting Diodes (LEDs), Micro-Electro-Mechanical Systems (MEMS), micro-mechanical devices, microelectronic devices and systems, nanotechnology devices and systems, Nano-Electro-Mechanical Systems (NEMS), photonic devices, and any devices and/or structures made from silicon carbide and/or gallium nitride. The disclosed method also has application in the fabrication of through-substrate vias and through-wafer vias, including those that are subsequently filled with electrically conductive materials.

Method for etching deep, high-aspect ratio features into silicon carbide and gallium nitride

A package and method of packaging for integrated microfluidic devices and systems is disclosed wherein a package is made from individually processed and patterned layers of LTCC green tape, that is aligned and stacked, and then co-fired to form a stable LTCC ceramic packaging modules. Subsequently, microfluidic device die and/or integrated microfluidic systems device die are bonded to pre-determined areas of the packaging modules and the modules are aligned bonded together to form leak-free, sealed packages for the microfluidic devices and systems. The use of LTCC materials and techniques provides a low-cost flexible and easily customizable packaging approach for microfluidic devices and systems that can be designed and transitioned into production with significant development time and cost.

Packaging of microfluidic devices and microfluidic integrated systems and method of fabrication

A three-way (3-way) Micro-Electro-Mechanical Systems (MEMS)-based micro-valve device and method of fabrication for the implementation of a three-way MEMS-based micro-valve that uses a multicity of piezoelectric actuators. The 3-way has a wide range of applications including medical, industrial control, aerospace, automotive, consumer electronics and products, as well as any application(s) requiring the use of three-way micro-valves for the control of fluids. The three-way microvalve device and method of fabrication can be tailored to the requirements of a wide range of applications and fluid types. The microvalve can be used to control fluids at high pressures and provides for low flow resistances when the microvalve is open and has low leakage when closed.

Piezoelectrically-actuated microvalve device and method of fabrication

A three-way (3-way) Micro-Electro-Mechanical Systems (MEMS)-based micro-valve device and method of fabrication for the implementation of a three-way MEMS-based micro-valve which uses a single piezoelectric actuator. The present invention has a wide range of applications including medical, industrial control, aerospace, automotive, consumer electronics and products, as well as any application(s) requiring the use of three-way micro-valves for the control of fluids. The present invention allows for the implementation of a three-way microvalve device and method of fabrication that can be tailored to the requirements of a wide range of applications and fluid types. The microvalve may employ a novel pressure-balancing scheme wherein the fluid pressure balances the actuator mechanism so that only a small amount of actuation pressure (or force) is needed to switch the state of the actuator and device from open to closed, or closed to open.

Three-way piezoelectrically-actuated microvalve device and method of fabrication

A three-way (3-way) Micro-Electro-Mechanical Systems (MEMS)-based micro-valve device and method of fabrication for the implementation of a three-way MEMS-based micro-valve are disclosed. The micro-valve device has a wide range of applications, including medical, industrial control, aerospace, automotive, consumer electronics and products, as well as any application(s) requiring the use of three-way micro-valves for the control of fluids. The discloses three-way micro-valve device and method of fabrication that can be tailored to the requirements of a wide range of applications and fluid types, and can also use a number of different actuation methods, including actuation methods that have very small actuation pressures and energy densities even at higher fluidic pressures. This is enabled by a novel pressure-balancing scheme, wherein the fluid pressure balances the actuator mechanism so that only a small amount of actuation pressure (or force) is needed to switch the state of the actuator and device from open to closed, or closed to open.

Three-way microvalve device and method of fabrication

The present invention is directed to a method for the fabrication of electron field emitter devices, including carbon nanotube (CNT) field emission devices. The method of the present invention involves depositing one or more electrically conductive thin-film layers onto an electrically conductive substrate and performing lithography and etching on these thin film layers to pattern them into the desired shapes. The top-most layer may be of a material type that acts as a catalyst for the growth of single- or multiple-walled carbon nanotubes (CNTs). Subsequently, the substrate is etched to form a high-aspect ratio post or pillar structure onto which the previously patterned thin film layers are positioned. Carbon nanotubes may be grown on the catalyst material layer. The present invention also described methods by which the individual field emission devices may be singulated into individual die from a substrate.

Method for the fabrication of electron field emission devices including carbon nanotube electron field emission devices

The present invention is directed to a method for the fabrication of electron field emitter devices, including carbon nanotube (CNT) field emission devices. The method of the present invention involves depositing one or more electrically conductive thin-film layers onto a electrically conductive substrate and performing lithography and etching on these thin film layers to pattern them into the desired shapes. The top-most layer may be of a material type that acts as a catalyst for the growth of single- or multiple-walled carbon nanotubes (CNTs). Subsequently, the substrate is etched to form a high-aspect ratio post or pillar structure onto which the previously patterned thin film layers are positioned. Carbon nanotubes may be grown on the catalyst material layer. The present invention also described methods by which the individual field emission devices may be singulated into individual die from a substrate.

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Reston, VA, United States of America

Michael A Huff