Olin Corporation

Michael A Holmes

Dexin Liang

German J Ramirez

Deepak Mahulikar

Arvind Parthasarathi

Andrew J Brock

Efraim Sagiv

Satish K Jalota

Jeffrey M Schlater

Paul R Hoffman

George A Brathwaite

There is provided an anodizable aluminum substrate having an increased breakdown voltage. The increase in breakdown voltage is achieved by selecting an appropriate aluminum alloy and appropriate processing parameters. Sealing the anodic film increases the breakdown voltage by decreasing corrosion. A preferred sealant is an epoxy cresol novolac having a low room temperature viscosity that cures to a highly cross-linked polymer.

Anodized aluminum substrate having increased breakdown voltage

There is disclosed an adhesively sealed electronic package in which a compensation apparatus is provided for excess adhesive. As a result, excess adhesive does not extend beyond the package perimeter, squeeze-out, or travel along the inner lead fingers interfering with wire bonding. The compensation is a chamfer on the peripheral edges and/or interior edges of the package base component and cover component.

Chamfered electronic package component

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Ripon, CA, United States of America

Michael A Holmes