International Business Machines Corporation

Globalfoundries Inc.

Sumitomo Bakelite Company Limited

Globalfoundries U.S. 2 LLC

Michael A Gaynes

Mark Vincent Pierson

Jerzy Maria Zalesinski

Evan G Colgan

Charles Gerard Woychik

Eric A Johnson

Timothy Joseph Chainer

Edward John Yarmchuk

Jae-Woong Nah

Jeffrey Donald Gelorme

Stephen L Buchwalter

Luis Jesus Matienzo

William Louis Brodsky

Kenneth Parker Rodbell

David L Questad

James A Busby

James Robert Wilcox

William E Bernier

Michael S Gordon

Silvio Dragone

Benson Chan

Steven Paul Ostrander

William Santiago-Fernandez

Thomas Edward Lombardi

John M Lauffer

Hilton T Toy

Ravi F Saraf

Frank Louis Pompeo

Bernd Karl Appelt

James L Hedrick

Voya Rista Markovich

Robert Dennis Miller

Sri Muthuthamby Sri-Jayantha

Da-Yuan Shih

Frank Daniel Egitto

Craig Jon Hawker

Jeffrey Allen Zitz

Kostas I Papathomas

James L Speidell

Eric Peter Lewandowski

Kenneth Raymond Carter

Roger R Schmidt

Mukta G Farooq

Theodore Gerard Van Kessel

David Clifford Long

Bing Dang

Mark Delorman Schultz

Bucknell Chapman Webb

Yves Corfield Martin

Konstantinos I Papathomas

Thomas Weiss

Kamal Kumar Sikka

David Brian Stone

Katsuyuki Sakuma

Wayne John Howell

Brent A Wacaser

Michael J Fisher

David James Alcoe

Irving Memis

David V Caletka

John Harold Magerlein

Madhusudan K Iyengar

John Ulrich Knickerbocker

Paul William Coteus

Paul Alfred Lauro

Stefano Sergio Oggioni

Raschid Jose Bezama

Emanuel Israel Cooper

Vinod Kamath

Carlos Juan Sambucetti

Natalie Barbara Feilchenfeld

Mark Edward Steinke

Robert L Sandstrom

Naim Moumen

David P Graybill

Xiaojin Wei

Rajneesh Kumar

Daniel C Edelstein

Claude Louis Bertin

William R Tonti

Paul Stephen Andry

Roy Rongqing Yu

Pritish Ranjan Parida

Duixian Liu

Thomas M Shaw

Thomas J Brunschwiler

George Frederick Walker

Scott Kevin Reynolds

David L Edwards

Sung Kwon Kang

Bruce Kenneth Furman

Erik L Hedberg

Cornelia K Tsang

Claudius Feger

Anilkumar Chinuprasad Bhatt

Gerard McVicker

Mario John Interrante

Kang-Wook Lee

David Hirsch Danovitch

Howard Victor Mahaney, Jr

Exemplary embodiments of the invention include a method and apparatus for assembling a semiconductor device. The method may include heating the semiconductor device, which comprises a printed circuit card and a packaging laminate, according to a device heating profile to melt solder material located between an array of contact points on the printed circuit card and an array of corresponding contact points on the packaging laminate; and cooling the semiconductor device to solidify the solder material, wherein during at least a portion of the cooling a temperature of the printed circuit card is kept at substantially a same temperature or a higher temperature than a temperature of an electronic module attached to the packaging laminate opposite the corresponding array of contact points.

Circuit card attachment for enhanced robustness of thermal performance

An electronic component to be encapsulated is introduced into a mold cavity. The mold cavity includes at least first and second halves, and at least one of the halves is formed with a negative of a thermal-interface-material engaging pattern thereon. An encapsulating material, which encapsulates the electronic component and engages the negative of the thermal-interface-material engaging pattern, is introduced into the mold cavity. The encapsulating material is allowed to solidify such that a thermal-interface-material engaging surface of the encapsulant solidifies with the thermal-interface-material engaging pattern thereon. During subsequent assembly, the thermal-interface-material engaging pattern engages thermal interface material to resist lateral motion of the thermal interface material.

Thermal interface adhesion for transfer molded electronic components

An electric potential is applied to first and second electrodes on opposite sides of a gap between an electronic component and a heat spreader. At least one of a thermal interface material in the gap, the electronic component and the heat spreader is subjected to a changing physical condition. The capacitance is monitored. Such a method can be practiced using an array of components sharing a common heat spreader. An assembly for testing thermal interfaces includes a printed circuit board, a plurality of electronic components mounted to and operatively associated with the printed circuit board, a heat spreader positioned for absorbing heat generated by the electronic components, a first electrode associated with the heat spreader, a plurality of second electrodes associated, respectively, with the electronic component, and a device for monitoring electrical capacitances. The technique may be employed for monitoring physical changes in electronic devices.

Using in situ capacitance measurements to monitor the stability of interface materials in complex PCB assemblies and other structures

An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.

Method and apparatus for strain relieving surface mount attached connectors

Devices that have integrated cooling structures for two-phase cooling and methods of assembly thereof are provided. In one example, a chip manifold can be affixed to a chip. An interface can be located at a first position between the chip manifold and the manifold cap. Furthermore, the interface can create a seal.

Chip package for two-phase cooling and assembly process thereof

Tamper-proof electronic packages and fabrication methods are provided which include a glass substrate. The glass substrate is stressed glass with a compressively-stressed surface layer. Further, one or more electronic components are secured to the glass substrate within a secure volume of the tamper-proof electronic package. In operation, the glass substrate is configured to fragment with an attempted intrusion event into the electronic package, and the fragmenting of the glass substrate also fragments the electronic component(s) secured to the glass substrate, thereby destroying the electronic component(s). In certain implementations, the glass substrate has undergone ion-exchange processing to provide the stressed glass. Further, the electronic package may include an enclosure, and the glass substrate may be located within the secure volume separate from the enclosure, or alternatively, the enclosure may be a stressed glass enclosure, an inner surface of which is the glass substrate for the electronic component(s).

Tamper-proof electronic packages with stressed glass component substrate(s)

Tamper-proof electronic packages and fabrication methods are provided which include a glass enclosure enclosing, at least in part, at least one electronic component within a secure volume, and a tamper-respondent detector. The glass enclosure includes stressed glass with a compressively-stressed surface layer, and the tamper-respondent detector monitors, at least in part, the stressed glass to facilitate defining the secure volume. The stressed glass fragments with an attempted intrusion event through the stressed glass, and the tamper-respondent detector detects the fragmenting of the stressed glass. In certain embodiments, the stressed glass may be a machined glass enclosure that has undergone ion-exchange processing, and the compressively-stressed surface layer of the stressed glass may be compressively-stressed to ensure that the stressed glass fragments into glass particles of fragmentation size less than 1000 &#x3bc;m with the intrusion event.

Tamper-proof electronic packages formed with stressed glass

Arrays of objects on a substrate having void-free underfill as well as methods and systems of forming the same include forming a void-free layer of underfill material between a substrate and an array of multiple objects positioned on the substrate. The void-free layer of underfill material is cured to form a protective cured underfill layer that provides structural support to connections between the objects and the substrate.

Underfill dispensing using funnels

A method comprises applying an adhesive to a first substrate and a second substrate to secure the first substrate to the second substrate. The adhesive extends in a plane on one side of an interposer that also extends in the plane, and is contiguous with the adhesive. The interposer comprises openings to enable flow of adhesive through the openings to form adhesive bond areas on one of the substrates where the areas substantially conform to the openings and lie adjacent to adhesive free areas. The adhesive substantially covers the other of the substrates so that the bond areas produce regions of reduced adhesive strength to the one substrate compared to the bond strength of the adhesive to the other substrate. Adjusting opening sizes adjusts area bond strengths. One substrate may comprise a VTM, the other a heat spreader, and the adhesive, a TIM. An article of manufacture comprises the substrate-adhesive-interposer-adhesive-substrate layers.

Thermal interface solution with reduced adhesion force

Water soluble, low alpha particle emission, electrically conductive coatings and techniques for formation thereof are provided. In one aspect, a method for forming an electrically-conductive coating on a substrate includes the steps of: forming an aqueous solution of a water soluble polymer (e.g., a polyvinylpyrrolidinone polymer or copolymer); adding electrically conductive filler particles to the aqueous solution above a percolation threshold to form a mixture; and depositing the mixture onto the substrate to form a low alpha particle emitting, electrically-conductive coating on the substrate, wherein the coating blocks alpha particles from being emitted from the substrate. An article and an alpha particle detector having a surface(s) thereof covered with the coating are also provided.

Water soluble low alpha particle emission electrically-conductive coating

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Vestal, NY, United States of America

Michael A Gaynes