USA as Represented by Secretary of the Navy

Other

Michael A Deeds

David L Herman

Daniel Louis Jean

Kevin Cochran

Richard Christopher Low

Gerald R Laib

David Olson

Eric Linn

John E Hendershot

Gregory Kaminski

Allen Keeney

Veronica Valeriano

Christopher Hovland

A movable capacitive sensing component and plural stationary capacitive sensing components are similarly constructed and are located together. The movable capacitive sensing component includes two interdigitated electrode elements at least one of which moves in accordance with displacement of an object. The stationary capacitive sensing components includes two interdigitated electrode elements that do not move, and differ from each other in terms of relative displacement between the fixed electrode elements. The movable capacitive sensing component measures a capacitance value. Another capacitance value is estimated, from the capacitance values measured by the stationary capacitive sensing components, for the displacement indicated by the movable capacitive sensing component's measured capacitance value. The actual displacement of the object is found by subtracting the respective capacitance values and converting this result to displacement, or by converting the respective capacitance values to displacement and subtracting the respective displacement values.

Environmentally compensated capacitive sensor

A MEMS type actuator includes a substrate defining a plane; a micro bellows disposed on the substrate and operable to expand in a direction out of a substrate plane, the substrate having an opening therein for fluid flow to the micro bellows; and a ramp disposed above the micro bellows. In a collapsed position of the micro bellows, the ramp is substantially parallel to the plane of the substrate and, in expanded positions of the micro bellows, the micro bellows applies a force to the ramp thereby causing rotation of the ramp in a direction out of the substrate plane.

Out-of-plane deflection MEMS actuator for projectile control surfaces

A system for protecting a diaphragm of a microelectromechanical systems (MEMS) device includes a housing coupled to the MEMS device such that its sensing diaphragm is surrounded thereby. A perforated barrier in the housing is adjacent to the sensing diaphragm. A protection diaphragm in the housing has its first side exposed to an external environment of interest, and has its second side facing the perforated barrier and spaced apart therefrom. A fluid is disposed contiguously between the second side of the protection diaphragm and the sensing diaphragm.

Protection system for diaphragm of MEMS device

To fabricate high aspect ratio metal structures, a two-layer structure is provided on a conductive layer. The two-layer structure includes a first layer adjacent the conductive layer and a second layer adjacent the first layer where the second layer is etchable by a Deep Reactive Ion Etching (DRIE) process. Using the DRIE process, at least one selected region of the second layer is completely etched away with the selected region being at least partially aligned with a region of the conductive layer such that the first layer is then exposed thereover. The first layer so-exposed is then removed to expose the region of the conductive layer thereunder. Metal is electroplated onto the exposed conductive layer and any remaining portions of the two-layer structure are then removed.

Method of fabricating high aspect ratio metal structures

An electrical generator includes a fluid-flow driven impeller including at least one impact arm; and at least one cantilevered beam disposed such that the impact arm strikes the cantilevered beam as the impeller rotates. The cantilevered beam at least partially includes a piezoelectric film.

Flow driven piezoelectric energy harvesting device

A MEMS type flow actuated out-of-plane flap apparatus includes a substrate defining a plane; a duct attached to the substrate, the duct and the substrate defining a fluid flow channel; and a rotatable flap having a flow receiving portion and an extension portion. The flow receiving portion being disposed in the fluid flow channel where, in an actuated position of the flap, a fluid flow against the flow receiving portion causes rotation of the flap and movement of the extension portion out of the plane of the substrate.

MEMS type flow actuated out-of-plane flap

A MEMS apparatus includes a substrate; electrical contacts disposed on the substrate; a thermal arch beam supported by and connected between the contacts, the thermal arch beam including a midpoint and a protrusion located at about the midpoint; a lever having an axis of rotation and a bearing surface upon which the protrusion is operable to bear, a pair of lever supports disposed on the substrate for rotatably supporting the lever about the axis of rotation, an area of contact between the protrusion and the bearing surface being positioned vertically between the axis of rotation and the plane of the substrate. A voltage difference between the electrical contacts causes the thermal arch beam to move horizontally in the plane and the protrusion to bear against the lever causing rotation of the lever out of the plane.

MEMS type thermally actuated out-of-plane lever

A projectile includes a projectile body including a flow surface; the flow surface including at least one control surface formed therein. The controls surface is formed continuous with the flow surface, and a pressure source is connected to at least one control surface. The pressure source delivers a pressure to at least one control surface to cause at least one control surface to bulge away from the flow surface.

MEMS control surface for projectile steering

A method of sealing an optical fiber in a microchip includes providing a device microchip, a top microchip and an optical fiber; forming a groove in at least one of the device microchip and the top microchip; coating metal on the optical fiber; depositing metal on the groove and top surfaces of the device microchip and the top microchip; depositing solder on the top surface of at least one of the device microchip and the top microchip; placing the optical fiber in the groove; placing the top microchip on the device microchip; and reflowing the solder to form a hermetic seal.

Microchip-level optical interconnect

The invention comprises an improvement to the prior art differential pressure fluid flow meter described in U.S. Pat. No. 6,308,581. The prior art fluid flow meter includes a longitudinal recess angled to the surface of the vessel so as to form a ramp, and a dynamic port surface angled extending from the floor of the ramp to the surface. The dynamic port is formed in the dynamic port surface and is connected through a dynamic port channel to a pressure transponder. The improvement comprises combining the above described differential pressure fluid flow meter with a low pressure port, at an angle less than 90 degrees to the dynamic port, wherein fluid flow draws pressure from the low pressure port in a direction counter to fluid flow entering the dynamic port.

High output differential pressure flow sensor

The fluid flow meter of the present invention includes a ramp inclined to the surface of a vessel so as to form a recess in the surface. A dynamic port surface extends from the lower end of the ramp to the surface of the vessel. A dynamic port is formed in the surface of the vessel, and a static port is formed in the ramp. The differential pressure between the dynamic and static ports is measured and is related to the flow velocity of fluid over the surface. The inventive flow meter has advantages of reduced drag, reduced likelihood of fouling and reduced likelihood of impact damage compared to conventional flow meters.

Growing community of inventors

Port Tobacco, MD, United States of America

Michael A Deeds