Future Wei Technologies, Inc.

Cadence Design Systems, Inc.

Shanghai Zhaoxin Semiconductor Co., Ltd.

Miao Liu

Liang Gu

Yuming Cao

Hung-Yi Lee

Shou-Po Shih

Gong Tom Lei

Yen Dang

Yifan Gu

Mamatha Deshpande

Liqun Deng

Yi Bu Li

Pinhong Chen

Xiaojing Li

Richard M Chou

Yufeng Luo

Guozhi Xu

Chin-Chih Chang

Disclosed is an improved approach for implementing a three-dimensional integrated circuit design with mixed macro and standard cell placement. This approach concurrently places both the macros and standard cells of the 3D-IC design onto two or more stacked floorplan and optimize the instance locations by timing, density, wire length and floorplan constraint.

Electronic design 3D mixed placement and unfolding

Disclosed is an approach to implement multi-die concurrent placement, routing, and/or optimization across multiple dies. This permits the multiple dies to be modeled as a single 3D space. Instead of being limited to a 2D plane, a cell can be placed to the area of any of the dies without splitting the netlist beforehand.

Concurrent optimization of 3D-IC with asymmetrical routing layers

A method for predicting an operation parameter of an integrated circuit includes the following steps. A plurality of cells used by the integrated circuit are provided. A voltage-frequency sweep test is performed on each of cells through a test model to generate a plurality of parameters, wherein the parameters correspond to a voltage value. A lookup table is established according to the parameters. A timing signoff corresponding to the integrated circuit is obtained. A timing analysis is performed on a plurality of timing paths of the integrated circuit according to the timing signoff and the parameters of the lookup table to obtain a critical timing path, and the operation parameter of the integrated circuit is predicted according to the critical timing path.

Method and device for predicting operation parameter of integrated circuit

An optical data circuit includes threshold adjustment circuits to perform threshold adjustment compensation of asymmetrical optical noise. The optical data circuit includes an optical-to-electrical conversion circuit configured to produce first and second differential electrical data signals, at respective first and second electrical nodes, in response to an optical data signal. First and second digital-to-analog converter (DAC) circuits are each respectively coupled to the first and second electrical nodes and configured to respectively generate first and second adjustment signals. The first and second DAC circuits are configured to adjust the first and second differential electrical data signals such that a zero-crossing point of positive data is pulled up in response to the first adjustment signal and a zero-crossing point of negative data is pulled down in response to the second adjustment signal.

Threshold adjustment compensation of asymmetrical optical noise

A reference-less frequency detector circuit includes a sampling circuit that is configured to generate a frequency control voltage and a switch circuit control signal based on a frequency difference between a clock signal frequency and an input data rate. The frequency control voltage has a frequency down indication and a frequency up indication. A voltage-to-current converter circuit is coupled to the sampling circuit and is configured to convert the frequency control voltage to a frequency control current based on the switch circuit control signal. The voltage-to-current converter circuit includes an output switch circuit controlled by the switch control signal and is configured to have substantially equal respective latencies for the frequency down indication and the frequency up indication.

Wide capture range reference-less frequency detector

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Shanghai, China

Miao Liu