Sabic Global Technologies B.v.

Shpp Global Technologies B.v.

Mian Dai

Liang Shen

Jian Wang

Wei Shan

Qin Wang

Shijie Song

Hariharan Ramalingam

Kazuhiko Mitsui

Zhenke Wei

Tsutomu Kinoshita

Zhuxia Rong

Miao Shen

Katsura Hayashi

Huabin Liu

A thermoplastic composition includes an aromatic poly(ketone), a poly(etherimide), and a reactive additive, wherein each component is present in a particular amount as defined herein. The thermoplastic composition can be useful in an insulating layer disposed over a conductor wire to form an electrical wire. Articles including the thermoplastic composition can be particularly useful in applications including an electrical device component, a railway vehicle component, an auto-mobile component, a marine vehicle component, a construction component, construction component, a building component, or an aircraft component.

Thermoplastic composition, electrical wire and article comprising the electrical wire

A thermoplastic composition includes a poly(phthalamide), a poly(etherimide-siloxane), and optionally, an additive composition. The respective amounts of each component are further described herein. A method for the manufacture of the composition includes melt-mixing the components of the composition, and optionally, extruding the composition. Articles including the thermoplastic composition are also described.

Poly(etherimide-siloxane)/poly(phthalamide) compositions, articles prepared therefrom, and methods for the manufacture thereof

A coating layer includes a composite of a fluoropolymer and a high heat thermoplastic polyimide, the thermoplastic polyimide having 5 to 1000 units of the formula (I): wherein each V is the same or different, and is a substituted or unsubstituted tetravalent Chydrocarbon group, and each R is the same or different, and is a substituted or unsubstituted Cdivalent organic group A method of manufacturing a coating composite, coated substrates and articles are also described. 

Coatings, methods and coated articles

A thermoplastic composition includes from about 50 wt. % to about 90 wt. % of a polymeric base resin and from about 10 wt. % to about 50 wt. % of a low dielectric constant (Dk)/low dissipation factor (Df) glass fiber component. The low Dk/low Df glass fiber component has a Dk of less than about 5.0 at a frequency of from 1 MHz to 1 GHz and a Df of less than about 0.002 at a frequency of from 1 MHz to 1 GHz. In certain aspects the thermoplastic composition has a Dk that is at least about 0.1 lower than a substantially identical reference composition that does not include the low Dk/low Df glass fiber component.

Thermoplastic compositions for electronics or telecommunication applications and shaped article therefore

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Mian Dai