Lumentum Operations LLC

Trilumina Corporation

Other

Sandia Corporation

Mial E Warren

Richard F Carson

Nein-Yi Li

John Richard Joseph

Preethi Dacha

Kevin L Lear

Stanley H Kravitz

David Podva

Thomas A Wilcox

Marcelino Guadalupe Armendariz

G Ronald Hadley

Tom Wilcox

Morris Burton Snipes, Jr

Thomas Fanning

Gianluca Bacchin

Rich Carson

James Cole Word, V

A VCSEL/VECSEL array design is disclosed that results in arrays that can be directly soldered to a PCB using conventional surface-mount assembly and soldering techniques for mass production. The completed VCSEL array does not need a separate package and no precision sub-mount and flip-chip bonding processes are required. The design allows for on-wafer probing of the completed arrays prior to singulation of the die from the wafer. Embodiments relate to semiconductor devices, and more particularly to multibeam arrays of semiconductor lasers for high power and high frequency applications and methods of making and using the same.

Surface-mount compatible VCSEL array

Methods, devices and systems are described for enabling a series-connected, single chip vertical-cavity surface-emitting laser (VCSEL) array. In one aspect, the single chip includes one or more non-conductive regions one the conductive layer to produce a plurality of electrically separate conductive regions. Each electrically separate region may have a plurality of VCSEL elements, including an anode region and a cathode region connected in series. The chip is connected to a sub-mount with a metallization pattern, which connects each electrically separate region on the conductive layer in series. In one aspect, the metallization pattern connects the anode region of a first electrically separate region to the cathode region of a second electrically separate region. The metallization pattern may also comprise cuts that maintain electrical separation between the anode and cathode regions on each conductive layer region, and that align with the etched regions.

VCSEL device with multiple stacked active regions

A wide-angle illuminator module including a rigid support structure having a plurality of angled faces, a flexible circuit including one or more VCSEL arrays, each VCSEL array positioned over a face among the plurality of angled faces, each VCSEL array including a plurality of integrated microlenses with one microlens positioned over each VCSEL in the VCSEL array, and a driver circuit for providing electrical pulses to each VCSEL array, wherein the plurality of VCSEL arrays address illumination zones in a combined field of illumination. The support structure may also be a heatsink. The flexible circuit may be a single flexible circuit configured to be placed over the support structure or a plurality of flexible circuits, each including one VCSEL array.

Wide-angle illuminator module

Embodiments comprise a system created through fabricating a lens array through which lasers are emitted. The lens array may be fabricated in the semiconductor substrate used for fabricating the lasers or may be a separate substrate of other transparent material that would be aligned to the lasers. In some embodiments, more lenses may be produced than will eventually be used by the lasers. The inner portion of the substrate may be formed with the lenses that will be used for emitting lasers, and the outer portion of the substrate may be formed with lenses that will not be used for emitting lasers&#x2014;rather, through etching these additional lenses, the inner lenses may be created with a higher quality.

Semiconductor lens optimization of fabrication

Systems, methods, and devices disclosed herein relate to optical assemblies for spatial multiplexing, multi-zone illumination, and optical assemblies. In embodiments, light source arrays are aligned with one or more micro-lens assemblies to generate a specific field of illumination. In embodiments, surface-emitting light sources may be light-emitting diodes and/or surface-emitting lasers. The micro-lens array may be aligned with the light source arrays, on-axis or off-axis to a principal axis of corresponding lenses such that the light sources may be expanded to a desired divergence and field of illumination. In embodiments, multiple light sources may be combined to increase power output for a specific area of the field of illumination, and light sources may be driven independently depending on intended illumination.

Spatial multiplexing of lens arrays with surface-emitting lasers for multi-zone illumination

Single-chip series connected VCSEL array

Methods, devices and systems are described for selectively illuminating different zones of a field of view by a multi-zone illumination device. In one aspect, a multi-zone illuminator may include a plurality of vertical cavity surface emitting lasers (VCSELs), and a plurality of micro-optical devices aligned with apertures of individual or groups of VCSELs, which are configured to be individually activated to provide adjustable illumination to different zones of a field of view of an image sensor. In another aspect, a method of selective illumination may include receiving information specifying a field of view of a camera, and controlling at least two sub arrays or individual illuminators of an illuminating array to output light at independently adjustable illumination powers, wherein each of the at least two sub arrays are independently configurable to illuminate at least one of a plurality of separate zones corresponding to the field of view of the camera.

Compact multi-zone infrared laser illuminator

A VCSEL device having a mesa for generating laser light includes a centralized thermal containment area and a thermal discharge area surrounding the centralized thermal containment area. The device includes a thermal lensing structure for enhancing or controlling heat flow within the centralized thermal containment area and the thermal discharge area and creating and maintaining an index of refraction between the centralized thermal containment area and the thermal discharge area. The VCSEL device operates as a multimode device when driven at a first current in a continuous wave and the VCSEL device operates as a single mode device when driven at a second current at a pulse rate shorter than an overall thermal time constant of the VCSEL device.

High brightness pulsed VCSEL sources

A VCSEL array device formed of a monolithic array of raised VCSELs on an electrical contact and raised inactive regions connected to the electrical contact. The VCSELs can be spaced symmetrically or asymmetrically, in a manner to improve power or speed, or in phase and in parallel. The raised VCSELs and raised inactive regions are positioned between the electrical contact and an electrical waveguide. The VCSELs may be separated into subarrays and each VCSEL may be covered with an integrated or bonded microlens for directing light without external lenses. The microlenses may be offset to collect or collimate light and may be shaped to form various lens profiles.

Microlenses for multibeam arrays of optoelectronic devices for high frequency operation

A structure and method for packaging an integrated optic circuit. The package comprises a first wall having a plurality of microlenses formed therein to establish channels of optical communication with an integrated optic circuit within the package. A first registration pattern is provided on an inside surface of one of the walls of the package for alignment and attachment of the integrated optic circuit. The package in one embodiment may further comprise a fiber holder for aligning and attaching a plurality of optical fibers to the package and extending the channels of optical communication to the fibers outside the package. In another embodiment, a fiber holder may be used to hold the fibers and align the fibers to the package. The fiber holder may be detachably connected to the package.

Package for integrated optic circuit and method

A fiber alignment apparatus includes a micro-machined nickel spring that captures and locks arrays of single mode fibers into position. The design consists of a movable nickel leaf shaped spring and a fixed pocket where fibers are held. The fiber is slid between the spring and a fixed block, which tensions the spring. When the fiber reaches the pocket, it automatically falls into the pocket and is held by the pressure of the leaf spring.

Growing community of inventors

Albuquerque, NM, United States of America

Mial E Warren