Lg Chem, Ltd

Mi Seon Yoon

Kwang Joo Lee

Sang Hwan Kim

Sera Kim

Eun Yeong Kim

Sung Chan Park

Bora Yeon

A back grinding tape including a hard coating layer, an intermediate layer including a polyurethane-based resin, and an adhesive layer provided has an excellent water resistance, thus easily protecting patterns, and has an excellent adhesion between each layer, and thus each layer is not separated in the process of removing the tape, such that the back grinding tape is suitable for a back grinding process.

Back-grinding tape

The present disclosure relates to a back grinding tape including a polymer resin layer including a urethane (meth)acrylate resin containing 10 to 40 wt % of a repeating unit derived from a (meth)acrylate monomer or oligomer having a glass transition temperature of 0&#xb0; C. or higher, wherein the polymer resin layer has a glass transition temperature of &#x2212;30&#xb0; C. to 0&#xb0; C. The present disclosure also relates to a method of grinding a wafer using the back grinding tape.

Back grinding tape

Growing community of inventors

Daejeon, South Korea

Mi Seon Yoon