Lg Chem, Ltd

Mi Seon Kim

Hee Yong Shim

Hyun Sung Min

Chang Bo Shim

Hwa Yeon Moon

Kwang Su Seo

Young Chan Kim

Jun Hyoung Park

Seung Hyun Song

Won Ki Kim

Yong Seon Hwang

Jung Jin Shim

A coating composition is provided. The coating composition of the present application has excellent compatibility between the components. In addition, there is an advantage that the release layer formed from the coating composition of the present application has low transmittance for light having a wavelength of 380 nm or more.

Coating composition

There are provided a thermosetting resin composition for a semiconductor package and a prepreg and a metal clad laminate using the same. More particularly, there are provided a thermosetting resin composition for a semiconductor package capable of improving desmear characteristics by using a cyanate based ester resin and a benzoxazine resin in a thermosetting resin composition based on an epoxy resin and improving chemical resistance by using a slurry type filler to have high heat resistance and reliability, and a prepreg and a metal clad laminate using the same.

Thermosetting resin composition for semiconductor package and prepreg and metal clad laminate using the same

The present invention relates to a thermosetting resin composition for a semiconductor package and a prepreg using the same. Specifically, a thermosetting resin composition for a semiconductor package which exhibits a low curing shrinkage ratio and has a high glass transition temperature and greatly improved flowability by introducing acrylic rubber and mixing two specific inorganic fillers surface-treated with a binder of a specific composition at a certain ratio, and a prepreg using the same, are provided.

Thermosetting resin composition for semiconductor package and prepreg using the same

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Daejeon, South Korea

Mi Seon Kim