Amkor Technology, Inc.

Amkor Technology Singapore Holding Pte. Ltd.

Mi Kyeong Choi

Jin Seong Kim

Jae Ung Lee

Yung Woo Lee

Ludovico Estrada Bancod

Robert Lanzone

Gi Jung Kim

Edwin Joseph Adlam

Won Chul Do

Ji Hun Lee

Young Rae Kim

Min Hwa Chang

Wang Gu Lee

Dong Hyun Kim

Jin Ryang Hwang

A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.

Semiconductor package and manufacturing method thereof

A semiconductor package and a manufacturing method thereof, which can reduce the size of the semiconductor package and improve product reliability. In a non-limiting example embodiment, the method may comprise forming an interposer on a wafer, forming at least one reinforcement member on the interposer, coupling and electrically connecting at least one semiconductor die to the interposer to the interposer, filling a region between the semiconductor die and the interposer with an underfill, and encapsulating the reinforcement member, the semiconductor die and the underfill on the interposer using an encapsulant.

Semiconductor device and manufacturing method thereof

Growing community of inventors

Seoul, South Korea

Mi Kyeong Choi