Samsung Electronics Co., Ltd.

Mi-Jin Kwon

Dongho Kim

Sooyong Lee

Seunghune Yang

A method for manufacturing a semiconductor device, includes receiving a first layout including patterns for the manufacturing of the semiconductor device, generating a second layout by performing machine learning-based process proximity correction (PPC) based on features of the patterns of the first layout, generating a third layout by performing optical proximity correction (OPC) on the second layout, and performing a multiple patterning process based on the third layout. The multiple patterning process includes patterning first-type patterns, and patterning second-type patterns. The machine learning-based process proximity correction is performed based on features of the first-type patterns and features of the second-type patterns.

Growing community of inventors

Anyang-si, South Korea

Mi-Jin Kwon