International Business Machines Corporation

Qualcomm Incorporated

Globalfoundries Inc.

Silanna Asia Pte Ltd

Appulse Power Inc.

Mete Erturk

Anthony K Stamper

Robert Allen Groves

Douglas M Daley

Edward Jack Gordon

Alvin Jose Joseph

Zhong-Xiang He

Ravindra Vaman Shenoy

Ezra D B Hall

Qizhi Liu

Jeffrey Bowman Johnson

Edmund Juris Sprogis

Hanyi Ding

Aleksandar Radic

Peter James Lindgren

Donald William Kidwell, Jr

James Thomas Doyle

Jitae Kim

Phillip L Corson

David Scagnelli

Sebastian Theodore Ventrone

Kirk David Peterson

Douglas Duane Coolbaugh

Robert Mark Rassel

Evgeni Petrovich Gousev

Karim Arabi

Casey Jon Grant

Seyed-Behzad Mahdavikhah-Mehrabad

John D Gillis

Sheikh Mohammad Ahsanuzzaman

Omar James Bchir

Jon Lasiter

David S Collins

Kwan-Yu Lai

Theodoros Anemikos

Farsheed Mahmoudi

Anthony J Perri

Layal Rouhana

Paul A Niekrewicz

Edward J Gordon

A power adapter for supplying electrical power to a device includes a processor, an interface for power transfer with the device, a multi-winding feedback converter to receive an AC power input and to convert the AC power input to a DC power output over the interface for the device, and a power conversion control circuit. A voltage level of the DC power output is set based on a reference voltage produced by the processor. The power conversion control circuit receives the reference voltage and a control signal based on the voltage level of the DC power output to generate switch control signals to control switches of the multi-winding feedback converter to control the voltage level of the DC power output. The processor recognizes a load associated with the device and sets, using the reference voltage, the DC power output based on the recognized load.

AC/DC power adapter with multi-winding feedback converter

A power adapter for supplying electrical power to a mobile device. The power adapter may have a processor and an interface for data communication and power transmission with the mobile device, memory internal to a casing of the power adapter, and an AC/DC power conversion circuit electrically coupled to the processor. The AC/DC power conversion circuit is configured to receive an AC power input and convert the AC power input to a DC power output over the interface for the mobile device. The processor is configured to: recognize a load associated with the mobile device connected to the DC power output; set the DC power output based on the load; receive backup data from the mobile device over the interface; and store the backup data from the mobile device within the memory.

AC/DC power adapter with accessible internal memory

An integrated circuit device, such as a system-on-a-chip (SOC) device that includes an integrated or embedded voltage regulator, comprises an integrated capacitor and an integrated inductor having a magnetic core that can be fabricated in the same process as the capacitive structure of the integrated capacitor.

Inductor and capacitor integrated on a substrate

An inductor can include a first substrate, a magnetic piece, and a conductor. The first substrate can be formed within a second substrate. The magnetic piece can be connected to a first side of the first substrate. The conductor can be formed within the second substrate, on the second substrate, or both. The conductor can have an input and an output. The conductor can be configured to surround the first substrate without being in contact with the first substrate and without being in contact with the magnetic piece.

Embedded thin film magnetic carrier for integrated voltage regulator

An integrated device package includes a die and a package substrate. The package substrate includes at least one dielectric layer (e.g., core layer, prepeg layer), a magnetic core in the dielectric layer, a first plurality of interconnects configured to operate as a first protective ring, and a second plurality of interconnects configured to operate as a first inductor. The second plurality of interconnects is positioned in the package substrate to at least partially surround the magnetic core. At least one interconnect from the second plurality of interconnects is also part of the first plurality of interconnects. In some implementations, the first protective ring is a non-contiguous protective ring. In some implementations, the first inductor is a solenoid inductor. In some implementations, the magnetic core includes a carrier, a first magnetic layer, and a second magnetic layer.

Integrated device package comprising a magnetic core inductor with protective ring embedded in a package substrate

Embodiments are provided that include methods of designing an inductor. The inductor can include a conductive line including at least one turn and an opening positioned within an interior of a region of the conductive line. Embodiments of forming the inductor can include: providing an inductor design including a conductive line having at least one turn; determining a region of the conductive line that has current density below a threshold; and forming an opening in the region, the opening enclosed within the conductive line.

Methods of designing an inductor having opening enclosed within conductive line

Methods of fabricating an on-chip capacitor with a variable capacitance, as well as methods of adjusting the capacitance of an on-chip capacitor and design structures for an on-chip capacitor. The method includes forming first and second ports configured to be powered with opposite polarities, first and second electrodes, and first and second voltage-controlled units. The method includes configuring the first voltage-controlled unit to selectively couple the first electrode with the first port, and the second voltage-controlled unit to selectively couple the second electrode with the second port. When the first electrode is coupled by the first voltage-controlled unit with the first port and the second electrode is coupled by the second voltage-controlled unit with the second port, the capacitance of the on-chip capacitor increases.

On-chip capacitors with a variable capacitance for a radiofrequency integrated circuit

Disclosed is a resonator made up of three sections (i.e., first, second and third sections) of a semiconductor layer. The second section has an end abutting the first section, a middle portion (i.e., an inductor portion) coiled around the first section and another end abutting the third section. The first and third sections exhibit a higher capacitance to the wafer substrate than the second section. Also disclosed are a process control system and method that incorporate one or more of these resonators. Specifically, during processing by a processing tool, wireless interrogation unit(s) detect the frequency response of resonator(s) in response to an applied stimulus. The detected frequency response is measured and used as the basis for making real-time adjustments to input settings on the processing tool (e.g., as the basis for making real-time adjustments to the temperature setting(s) of an anneal chamber).

Passive resonator, a system incorporating the passive resonator for real-time intra-process monitoring and control and an associated method

Structures with high-Q value inductors, design structure for high-Q value inductors and methods of fabricating such structures is disclosed herein. A method in a computer-aided design system for generating a functional design model of an inductor is also provided. The method includes: generating a functional representation of a plurality of vertical openings simultaneously formed in a substrate, wherein a first of the plurality of vertical openings is used as through silicon vias and is etched deeper than a second of the plurality of vertical openings used for high-Q inductors; generating a functional representation of a dielectric layer formed in the plurality of vertical openings; and generating a functional representation of a metal layer deposited on the dielectric layer in the plurality of vertical.

Structure and design structure for high-Q value inductor and method of manufacturing the same

On-chip capacitors with a variable capacitance, as well as design structures for a radio frequency integrated circuit, and method of fabricating and method of tuning on-chip capacitors. The on-chip capacitor includes first and second ports powered with opposite polarities, first and second electrodes, and first and second voltage-controlled units. Each of the first and second voltage-controlled units is switched between a first state in which the first and second electrodes are electrically isolated from the first and second ports and a second state. When the first voltage-controlled unit is switched to the second state, the first electrode is electrically connected with the first port. When the second voltage-controlled unit is switched to the second state the second electrode is electrically connected with the second port. The on-chip capacitor has a larger capacitance value when the first and second voltage-controlled units are in the second state.

Disclosed are embodiments of a system and a method that allow for wireless and dynamic intra-process (i.e., during and/or between process steps) measurements of integrated circuit parameters. The embodiments incorporate the use of a passive circuit, such as an inductor-capacitor-resistor (LCR) circuit resonator, that has a predetermined sensitivity to process variations in one or more physical or electrical integrated circuit parameters. The passive circuit can be wirelessly interrogated between and/or process steps. Then, the actual behavior exhibited by the passive circuit in response to the interrogation is compared to the expected behavior of an optimal circuit in the absence of process variations in order to determine the one or more parameters. Also disclosed is an embodiment of an exemplary passive circuit that can be used to implement the disclosed system and method embodiments.

System and method for wireless and dynamic intra-process measurement of integrated circuit parameters

Embodiments of an inductor including a conductive line including at least one turn and an opening positioned within an interior of a region of the conductive line are disclosed. Embodiments of a related method of designing the inductor are also disclosed.

Inductor having opening enclosed within conductive line and related method

Back-end-of-line (BEOL) wiring structures that include an on-chip inductor and an on-chip capacitor, as well as design structures for a radiofrequency integrated circuit. The on-chip inductor and an on-chip capacitor, which are fabricated as conductive features in different metallization levels, are vertically aligned with each other. The on-chip capacitor, which is located between the on-chip inductor and the substrate, may serve as a Faraday shield for the on-chip inductor. Optionally, the BEOL wiring structure may include an optional Faraday shield located vertically either between the on-chip capacitor and the on-chip inductor, or between the on-chip capacitor and the top surface of the substrate. The BEOL wiring structure may include at least one floating electrode capable of being selectively coupled with the electrodes of the on-chip capacitor to permit tuning, during circuit operation, of a resonance frequency of an LC resonator that further includes the on-chip inductor.

BEOL wiring structures that include an on-chip inductor and an on-chip capacitor, and design structures for a radiofrequency integrated circuit

Growing community of inventors

St. Albans, VT, United States of America

Mete Erturk