Synergy Microwave Corporation

Meta Rohde

Shankar R Joshi

Klaus Juergen Schoepf

Reimund Rebel

Ajay Kumar Poddar

Antonio Almeida

Mahadevan Sridharan

A printed circuit board having one or more vias disposed in the surface area of a pad. The pad may serve as a connection point between the printed circuit board and another circuit board and is disposed along the edge of the board such that the vias do not form half vias.

Visually inspectable surface mount device pad

A microwave frequency device includes: a first substrate having a dielectric layer and a conductive film disposed on opposing first and second sides of the dielectric layer, the conductive film on the first side of the dielectric layer of the first substrate including at least one signal line; and a second substrate having a dielectric layer, conductive film disposed on at least one of first and second opposing sides of the dielectric layer, and at least one cut-out where the dielectric layer and conductive film have been removed, wherein the first and second substrates are bonded together to form a bonded assembly such that (i) a portion of the signal line of the first substrate is sandwiched between the dielectric layers of the first and second substrates, and (ii) the at least one cut-out exposes a portion of the signal line, thereby forming a microstrip portion. A method of forming same is also disclosed.

Microwave frequency surface mount components and methods of forming same

A surface mount package particularly suitable for transformers and other components having numerous windings of fragile, difficult to handle wire has a housing which includes openings along the lower edge, the housing being plated with an electrically conductive material on portions of the lower edge and in areas surrounding the opening. A component is held within the housing, and the leads of the component are disposed in the openings at a point above the lower edge of the housing, and the leads are electrically connected to the plating surrounding the openings and the plating at the flat portions of the lower edge. The plating on the flat portions of the lower edge can be at any suitable location, i.e., remote from or adjacent to the openings. Additional components can be stacked on the exterior of the housing, as connected to the plating surrounding the openings. Also, the walls and/or the top of the housing can be plated to provide for versatility in connecting the housed component, or any other components, on and around the housing. The plating on the housing may be connected to the plating surrounding the openings and the plating at the flat portions of the lower edge, or may entirely independent of the housed electronic component.

Surface Mountable transformer

A manner of using a plurality of transformers having cylindrical cores such that operation of the transformers at high frequencies allows the cores of the transformers to be disposed parallel to each other and in relatively close proximity without substantial interference.

Plural transformers with elongated cores

A mass of dielectric material intimately surrounds a high frequency circuit having plural transformers in relative close proximity to one anther and provides mechanical stability and electrical protection to the circuit. The mass of dielectric material surrounding the circuit has a dielectric constant less than about 2.6 and a loss tangent less than about 0.009.

Encasement for circuit having plural transformers

A hermetically sealed surface mount electronic component package can be manufactured by converting standard, readily available flat-packs. The package has a base, with an opening through which a primary transmission lead extends, a glass-to-metal seal surrounding the transmission lead in the opening, and a secondary transmission lead extends from the primary transmission lead so that it is spaced from the base and its end is at least flush with the bottom of the base. An insulator can be provided between the primary transmission lead and the secondary transmission lead. A method of converting a standard flat-pack by providing a composite piece having a dielectric insulator, a secondary transmission lead for connection to the transmission lead of the flat-pack, and a connecting member for connecting the insulator and secondary transmission lead to the base of the flat-pack is also described.

Growing community of inventors

Upper Saddle River, NJ, United States of America

Meta Rohde