Commissariat &#xc0; L'&#xc9;nergie Atomique Et Aux &#xc9;nergies Alternatives

Commissariat a L'energie Atomique

Messaoud Bedjaoui

Sylvain Poulet

Steve Martin

Raphael Salot

Johnny Amiran

Gabriel Delepierre

Thomas Sebastien

Aboubakr Ennajdaoui

Jean Brun

Raphaël Salot

Sylvain Nizou

Nicolas Lopez

Jouhaiz Rouchou

Pierre Garrec

Hermance Desre

David Sionneau

A method for encapsulating a microelectronic device, arranged on a support substrate, with an encapsulation cover includes, inter alia, the following sequence of steps: a) providing a support substrate on which a microelectronic device is arranged, b) depositing a bonding layer on the first face of the substrate, around the microelectronic device, c) positioning an encapsulation cover on the bonding layer in such a way as to encapsulate the microelectronic device, d) thinning the second main face of the support substrate and the second main face of the encapsulation cover by chemical etching.

Method for encapsulating a microelectronic device, comprising a step of thinning the substrate and/or the encapsulation cover

Method for producing a positive electrode for a solid-state lithium microbattery comprising the following successive steps: supplying of a substrate made of ceramic, glass or silicon, locally covered with a metal layer, depositing of a cathodic layer made of a positive electrode material, for example made of mixed lithium oxide, the cathodic layer having a thickness greater than 1 &#x3bc;m, a first portion of the cathodic layer covering the substrate and a second portion of the cathodic layer covering the metal layer, intended to form the positive electrode, carrying out of a heat treatment at a temperature greater than or equal to 400&#xb0; C., on the cathodic layer, in such a way as to crystallise the second portion of the cathodic layer in order to form a positive electrode, and in such a way as to delaminate the first portion of the cathodic layer.

Method for manufacturing a positive electrode for a solid-state lithium microbattery

Process for encapsulation of a microelectronic device comprising the following steps in sequence: supply a support substrate comprising a first principal face on which a microelectronic device is placed, a second principal face, and a lateral face, deposit a bonding layer on the first principal face of the substrate, position an encapsulation cover comprising a first principal face, a second principal face, and a lateral face, on the bonding layer, deposit a lateral protection layer on: the lateral face and the periphery of the second principal face of the support substrate, the lateral face and the periphery of the second principal face of the encapsulation cover, the lateral protection layer delimiting a protected zone, thinning of the second principal face of the support substrate and/or the second principal face of the encapsulation cover outside the protected zone.

Process for encapsulation of a microelectronic device by easily manipulated thin or ultrathin substrates

Sealing cell for encapsulating a microelectronic component arranged on a substrate, with a cap, said sealing cell including: a bottom including a receiving zone for the substrate and a peripheral zone surrounding the receiving zone, a side wall formed of an internal face, an external face and an upper face, the upper face being configured to support the cap facing the receiving zone, an opening, arranged in the bottom of the cell, in the side wall, or in the cap, the opening being configured to be connected to a pumping system, in such a way as to be able to place under controlled atmosphere a cavity delimited by the side wall, the bottom and the cap.

Sealing cell and method for encapsulating a microelectronic component with such a sealing cell

The invention relates to an electronic system comprising at least one device comprising a substrate () carrying at least one electronic component provided with at least one electrical connector (), with the system further comprising a support of said device, characterised in that the device comprises at least one passage () according to a dimension in thickness of the device, said passage passing through the electrical connector (), and in that it comprises at least one electrically conductive pillar () protruding on a first face of the support, with the electrically conductive pillar () passing through the passage () by being configured to be in electrical continuity with the electrical connector () passed through by said passage.

Case for microelectronic components

A method for manufacturing an electronic device including a substrate, including assembling the substrate, by a joining zone of a first face of the substrate, with a joining zone of a first face of a carrier, and disjoining the substrate relatively to the carrier. After the step of assembling, the method includes formation of a film on the substrate, the film being configured to adhere to an adhesion zone of a second face of the substrate opposite the first face of the substrate, the adhesive force between the film and the adhesion zone of the second face of the substrate being chosen greater than the joining force between the joining zone of the carrier and the joining zone of the first face of the substrate. A traction on the film has a force of traction configured to overcome the joining force without overcoming the adhesive force.

Method for manufacturing an electronic device

Method for reversible bonding between a first element and a second element, comprising the implementation of the following steps:

Method for reversible bonding between two elements

A method of vertically assembling encapsulated single microbatteries, wherein the vertical assembly contains, between the microbatteries, an electrical insulation and/or sealing layer and a metal layer, successively including: a step of stacking and attaching at least two single microbatteries, previously encapsulated, stacked on each other; and forming a metal layer, capable of ensuring the electrical coupling of each of the metal layers of each of the encapsulated single microbatteries. Each of the at least two encapsulated single microbatteries is previously prepared by: forming at least one electrical insulation and/or sealing layer over at least a portion of the lateral sides and of the surface including the current collectors of a microbattery including positive and negative electrodes, an electrolyte, and positive and negative current collectors; making the current collectors of the microbattery accessible; and forming a metal layer extending from the current collectors to the lateral sides of said microbattery.

Method for assembling and encapsulating lithium microbatteries and microbatteries produced thereby

An electrochemical device, such as a microbattery or an electrochromic system, including at least one stack of active layers containing lithium, said stack being arranged on a substrate and being covered by an encapsulation layer. The encapsulation layer includes at least: a barrier film presenting at least one electrically insulating surface and including at least one layer hermetic to oxidising species, said adhesive film including a juxtaposition of electrically conducting adhesive strips and of electrically insulating adhesive strips, and an adhesive film, provided with a first surface and a second surface, the first surface being in contact with the electrically insulating surface of the barrier film and the second surface covering the stack of active layers and a part of the substrate.

Electrochemical device, such as a microbattery or an electrochromic system, covered by an encapsulation layer comprising a barrier film and an adhesive film, and method for fabricating one such device

This invention relates to a method for producing an electrical system comprising a support () bearing on a first face at least one device; with the device comprising at least one electronic component () provided with at least one electrical connector (), with the method comprising: a step of setting in place of a cover () positioned above the component; said cover () comprising at least one passage () according to a dimension in thickness of the cover () in such a way as to form an access space to the at least one electrical connector (), a step of forming a sealing seam () in such a way that the component is encapsulated in a sealed cavity () delimited by the first face of the support (), the first face of the cover () and the sealing seam (). The method comprises a step of filling with a conductive material of is at least one passage () of the cover () in such a way as to establish an electrical continuity between the conductive material and the at least one electrical connector (), formant a tapping () and in that the sealing seam () comprises a dielectric material.

Method of making a microelectronic device

A method for the production of a battery includes at least production, against a substrate made of a material able to form an electrode, of at least one solid electrolyte layer, production of a first electrode in contact with the electrolyte, and thinning the substrate such that at least a remaining proportion of the substrate, in contact with the solid electrolyte layer, forms a second electrode.

Method for the production of an all-solid battery

A lithium microbattery comprises a stack of active layers containing lithium and a protective cover covering the stack of active layers. The protective cover is fixed to the stack of active layers by means of a layer of glue. A buffer structure comprising at least one alumina layer is arranged between the stack of active layers and the layer of glue, the buffer structure being in contact with said stack of active layers.

Lithium microbattery protected by a cover

The method for producing a patterned layer of first material on a surface of a substrate comprises the following successive steps:

Deposition by spin coating of a patterned thin layer on a substrate

An electric battery including a microbattery provided with first and second current collectors and an encapsulation device including an electrically-conductive and sealing layer formed by a matrix made of polymer material including electrically-conductive particles. First and second connection pads made of electrically-conductive material are respectively electrically connected to the first and second current collectors of the microbattery. The encapsulation device also includes an additional microbattery provided with first and second current collectors, arranged opposite to and separate from the microbattery by the sealing layer. The first and/or second current collectors of the additional microbattery are electrically connected, respectively, to the first and/or second connection pads via at least a portion of the electrically-conductive particles.

Electric battery and means for encapsulating same

The method for patterning a polymer layer arranged on a support comprises deposition of a layer made from a lithium-based polymerization inhibitor material on a first area of the support, deposition of a cationically polymerizable material on the polymerization inhibitor layer and on a second area of the support, application of polymerization treatment resulting in a non-solidified sacrificial layer in the first area and the polymer layer in the second area, and elimination of the sacrificial layer.

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Voreppe, France

Messaoud Bedjaoui