Motorola Corporation

Mervi Paulasto

Will Specks

Nils Bossemeyer

An electronic package ( ) has a semiconductor device ( ), a two-layer ( ) printed circuit substrate ( ), and a lead ( ) for providing external connections for the package assembly ( ). The first layer ( ) has an electrical conducting surface structure ( ); and the second layer ( ) has a recess ( ) to receive the device ( ). The device frontside ( ) is electrically coupled to the conducting surface structure ( ) of the first layer ( ) in a flip-chip arrangement. The backside ( ) of the device ( ) is coplanar to the surface ( ) of the second layer ( ). The lead ( ) at least partially overlays the surface ( ) of the second layer ( ).

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Munich, Germany

Mervi Paulasto