Clarisay, Incorporated

Merrill A Hatcher

Martin P Goetz

Christopher Ellis Jones

A method of manufacturing a hermetic package. In one embodiment, the method includes: (1) forming a plurality of contact-sensitive electronic devices on a device substrate, each of the plurality of devices having an active surface, (2) providing a mounting substrate, (3) forming a grid of dam material between the device substrate and the mounting substrate that is pitched as a function of lateral dimensions of the plurality of devices, (4) bringing the device substrate and the mounting substrate together until the active surface of each of the plurality of devices is proximate, but spaced apart from, the mounting substrate, the mounting substrate and the dam material cooperating to form packages for the plurality of devices and (5) dicing the device substrate to separate the packages.

Hermetic package for multiple contact-sensitive electronic devices and methods of manufacturing thereof

A hermetic package for an electronic device, such as a surface acoustic wave (SAW) device and a method of manufacturing the same. In one embodiment, the package includes: (1) a device substrate having: (a) an active region containing an electrically conductive pattern that constitutes at least a portion of the device, (b) a contact region surrounding the active region and containing bond pads that are electrically coupled to the pattern and (c) a bonding region surrounding the active region, (2) a non-porous mounting substrate having a bonding region thereon and a footprint smaller than a footprint of the device substrate and (3) a bonding agent, located between the bonding region of the device substrate and the bonding region of the mounting substrate, that bonds the device substrate to the mounting substrate to enclose the active region proximate a void between the device substrate and the mounting substrate, the contact region remaining exposed.

Hermetic package for surface acoustic wave device having exposed device substrate contacts and method of manufacturing the same

The present invention provides a surface acoustic wave (SAW) circuit package including: (1) a substantially planar piezoelectric substrate having an active surface, (2) an electronic circuit located over the active surface, (3) an encapsulant substrate having a bonding surface and (4) a bonding material interposing and creating a hermetic seal between the active surface and the bonding surface and around a void between the piezoelectric substrate and the encapsulant substrate. In one embodiment, the void has lateral dimensions at least equaling a footprint of the electronic circuit.

Hermetic package for surface acoustic wave device and method of manufacturing the same

A hermetic package for a pyroelectric-sensitive electronic device and methods of manufacturing one or more of such packages. In one embodiment, the package includes: (1) a device substrate having: (1a) an active region containing an electrically conductive pattern that constitutes at least a portion of the device and (1b) a bonding region surrounding the active region, (2) a non-porous mounting substrate having a bonding region thereon and (3) a nonmetallic hermetic sealing adhesive, located between the bonding region of the device substrate and the bonding region of the mounting substrate, that cures at a temperature substantially below a pyroelectric sensitive temperature of the device, the active region proximate a void between the device substrate and the mounting substrate.

Growing community of inventors

Garland, TX, United States of America

Merrill A Hatcher