Apple Inc.

Menglu Li

Flynn P Carson

Karthik Shanmugam

Raymundo M Camenforte

Jun Zhai

Scott D Morrison

Kumar Nagarajan

Package structures, modules containing such packages and methods of manufacture. are described. In an embodiment, a package includes a plurality of terminal pads, a plurality of passive components bonded to top sides of the plurality of terminal pads, a die bonded to top sides of the plurality of passive components and a molding compound encapsulating at least the plurality of passive components and the die.

Molded silicon on passive package

Flexible packages and electronic devices with integrated flexible packages are described. In an embodiment, a flexibly package includes a first die and a second die encapsulated in a molding compound layer. A compliant redistribution layer (RDL) spans the molding compound layer and both dies, and includes electrical routing formed directly on landing pads of the dies. A notch is formed in the molding compound layer between the dies to facilitate flexure of the compliant RDL.

Flexible package architecture concept in fanout

Growing community of inventors

San Jose, CA, United States of America

Menglu Li