Goertek Inc.

Weifang Goertek Microelectronics Co., Ltd.

Mengjin Cai

Junkai Zhan

Zonglin Zhou

Guanxun Qiu

Qinglin Song

Zhe Wang

Maoqiang Dang

Jun Li

Jianglong Li

A MEMS microphone is provided, comprising a substrate having a back cavity, and a plate capacitor structure arranged on the substrate, the plate capacitor structure being formed by a vibration diaphragm, a backplate and a support portion; wherein a pressure relief device is provided in the vibration diaphragm, a pressure maintaining channel is formed between the vibration diaphragm and the backplate; and the pressure relief device in the vibration diaphragm constitutes an inlet of the pressure maintaining channel.

MEMS microphone

The present invention discloses a vibration diaphragm in an MEMS microphone, and an MEMS microphone. The vibration diaphragm comprises a vibration diaphragm body and at least one pressure relief device defined by gaps in the vibration diaphragm body, wherein the gaps comprise at least two sections of circular arc-shaped gaps sequentially connected together. The two adjacent sections of circular arc-shaped gaps are in an S shape as a whole and centrosymmetrical with respect to a connected position thereof. The pressure relief device comprises at least two valve clacks formed by at least two sections of adjacent circular arc-shaped gaps and neck portions connected to the valve clacks and the vibration diaphragm body and of a constraint shape.

Vibration diaphragm in MEMS microphone and MEMS microphone

The present disclosure discloses a sensitive diaphragm comprising a diaphragm body, an edge region of the diaphragm body being provided with a rim structure, wherein the rim structure is in a non-closed annular shape, a non-closed region is located at a part not closed by the rim structure, and the non-closed region are integral and continuous with parts of the diaphragm body adjacent to the rim structure. According to the sensitive diaphragm of the present disclosure, the annular rim structure is separated by the non-closed region.

Sensitive diaphragm with rim structure and sensor

The present invention provides a condenser microphone, comprising a substrate, and a back plate and a vibrating diaphragm which are arranged on the substrate; the back plate is arranged on the upper side and/or the lower side of the vibrating diaphragm; and the vibrating diaphragm is provided with a protruding layer or a corrugated membrane structure layer. With the above invention, the area of the vibrating diaphragm and the capacitance at the lateral side of the condenser microphone can be increased, so as to achieve the effect of improving the sensitivity of the condenser microphone.

Condenser microphone and electronic device

An environmental sensor and manufacturing method thereof. The environmental sensor comprises: a substrate comprising at least one recess disposed at an upper portion of the substrate; and a sensitive film layer disposed above the substrate, comprising a fixed portion fixed on an end surface of the substrate and a bent portion configured to extend inside the recess. The bent portion and a side wall of the recess form a capacitor configured to detect a signal. The bent portion, fixed portion, and the recess form a closed cavity. A conventional capacitive structure configured on a substrate surface is changed to a capacitive structure of the environmental sensor vertically extending into the inside of the substrate, increasing a depth of the recess, and in turn, increasing a sensing area between two polar plates of the capacitor, significantly shrinking a coverage area of the capacitor on the substrate, and satisfying a requirement of a modern compact electronic component.

Environmental sensor and manufacturing method thereof

Provided are a MEMS microphone chip and an MEMS microphone. The MEMS microphone chip comprises a substrate, a backplate and a vibration diaphragm, the backplate and the vibration diaphragm constituting two electrodes of a capacitor respectively, the backplate and the vibration diaphragm being suspended above the substrate, the backplate being located between the substrate and the vibration diaphragm, and the substrate being provided with a back chamber and a support column, the support column being connected to a side wall of the back chamber via a connection portion, a through hole or a notch being formed in the connection portion through its thickness direction, to allow spaces at opposite sides of the connection portion to communicate with each other; and the support column being configured to support the backplate.

MEMS microphone chip and MEMS microphone

The present invention discloses a piezoelectric microphone. The piezoelectric microphone comprises a substrate having a cavity-backed, and a piezoelectric film connected to the upper side of the substrate via an insulating layer. A position on the piezoelectric film, which is located at the inner side of a junction of the piezoelectric film and the substrate, is provided with a plurality of hollowed-out holes. The hollowed-out holes in the piezoelectric film are at least partly overlapped with the substrate. A gap is provided between the substrate and the position, where the hollowed-out holes are located, on the piezoelectric film. The gap and the hollowed-out holes a together form a channel. Compared with the traditional hollowed-out structure, the gap of the present invention can hinder the sound from directly spreading via the hollowed-out holes, thereby greatly reducing the amount of leakage of low-and-intermediate frequency signals of the piezoelectric microphone and improving the performance of the piezoelectric microphone. In addition, the gap can also effectively prevent a chip from being damaged by the invasion of dust, particles and water.

Piezoelectric microphone

An acoustic sensor integrated MEMS microphone structure and a fabrication method thereof. A diaphragm () and back-pole () which forms a condenser structure are formed on a substrate () having at least one recessed slot () on the top. A sensitive electrode is formed on the substrate (), the sensitive electrode comprising a fixed portion () fixed on the substrate () via a sacrificial layer (), and a bending portion () inserted into the recessed slot (), wherein the bending portion and the side wall of the recessed slot form the condenser structure. The integrated structure integrates the condenser structure of the microphone and condenser structure of the acoustic sensor on a substrate (), thereby increasing the integration level thereof and reducing the overall size of the package. Meanwhile, the microphone diaphragm () and the sensitive electrode of the acoustic sensor can be fabricated on a same substrate () at the same time, from the same material, and using the same fabricating process to increase production efficiency.

Acoustic sensor integrated MEMS microphone structure and fabrication method thereof

An MEMS microphone is disclosed, which comprises a substrate and a vibrating diaphragm and a back electrode which are located above the substrate, a plurality of comb tooth parts are formed in edge positions of the vibrating diaphragm, and the plurality of comb tooth parts are distributed in a peripheral direction of the vibrating diaphragm at intervals, wherein a position between every two adjacent comb tooth parts on the vibrating diaphragm is connected to the substrate via an insulating layer; and the comb tooth parts on the vibrating diaphragm are at least partially overlapped with the substrate, and a clearance exists between the comb tooth parts and the substrate and is configured as an airflow circulation channel. The microphone of the present invention has better impact resistance and can avoid intrusion of dust.

A method for forming a cavity of a sensor chip. The method comprises forming a first groove (a) on a substrate (a); bonding a covering layer (a) onto the substrate (a) to cover the first groove (a), thereby forming a cavity; and etching the covering layer (a) to decrease a thickness of the covering layer. The method can implement a thinner thickness of a film, thereby improving the sensitivity of a sensor.

Cavity forming method for a sensor chip, manufacturing method thereof, chip and electronics apparatus

A method for forming a filter net on an MEMS sensor and an MEMS sensor are disclosed. The method comprises the following steps: disposing a dissociable adhesive tape on a base material, and forming a filter net on an adhesive surface of the dissociable adhesive tape; transferring the filter net on a film to form a self-adhesive coiled material; and transferring and adhering the filter net on the self-adhesive coiled material to collecting a hole of the MEMS sensor. The filter net formed by the method have fine and uniform meshes, and a yield is high. In addition, the method is suitable for large-scale and industrialized production.

Method for forming filter net on MEMS sensor and MEMS sensor

The present invention relates to a silicon based MEMS microphone, comprising a silicon substrate and an acoustic sensing part supported on the silicon substrate, wherein a mesh-structured back hole is formed in the substrate and aligned with the acoustic sensing part, the mesh-structured back hole includes a plurality of mesh beams which are interconnected with each other and supported on the side wall of the mesh-structure back hole, the plurality of mesh beams and the side wall define a plurality of mesh holes which all have a tapered profile and merge into one hole in the vicinity of the acoustic sensing part at the top side of the silicon substrate. The mesh-structured back hole can help to streamline the air pressure pulse caused, for example, in a drop test and thus reduce the impact on the acoustic sensing part of the microphone, and also serve as a protection filter to prevent alien substances such as particles entering the microphone.

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Shandong, China

Mengjin Cai