Eternal Materials Co., Ltd.

Eternal Chemical Co., Ltd.

Meng-Yen Chou

Chung-Jen Wu

Chang-Hong Ho

Shun-Jen Chiang

Po-Yu Huang

Chung-Kai Cheng

Chuan Zong Lee

Shu-Wan Lu

Cheng-Tyng Yen

Chuan-Zong Lee

Chung-Hung Chang

Hsin-Wei Huang

Min-Chi Wang

Wen-Chang Chen

Chin-Min An

Chung-Hao Wu

Chin-Chang Chuang

Yu-Wen Wang

Kuo-Huang Hsieh

Pi-Chen Cheng

Yi-Chung Shih

Shun-Jen Ghiang

Meng-Tso Chen

Chih-Ming An

Shih-Chieh Yeh

Chun-Kai Cheng

Chih-Min An

The present invention provides an amic acid ester oligomer having a structure of Formula (1) or (1'): 

Precursor for polyimide and use thereof

The present invention relates to a method for preparing a patterned polyimide coverlay on a substrate. The method includes: providing a polyimide dry film including a carrier and a non-photosensitive polyimide layer on the carrier, the non-photosensitive polyimide layer containing (i) a polyimide precursor or soluble polyimide and (ii) a solvent; forming a predetermined pattern in the polyimide dry film; laminating the patterned polyimide dry film onto a substrate in such a manner that the non-photosensitive polyimide layer faces the substrate; and forming a patterned polyimide coverlay by heating.

Method for preparing patterned coverlay on substrate

The present disclosure relates to a polyimide precursor composition comprising an amic acid ester oligomer of formula (I): 

Polyimide precursor composition, use thereof and polyimide made therefrom

The present disclosure provides a polyimide resin having at least two glass transition temperatures measured by dynamic mechanical analysis (DMA). Also, a metal-clad laminate including the polyimide resin.

Polyimide resin and metal-clad laminate comprising the same

The present disclosure provides a metal clad laminate, a preparation method thereof, and a method for preparing a flexible circuit board by using the same. The metal clad laminate of the present disclosure includes a first metal foil, a first polyimide layer directly disposed on the first metal foil, a second metal foil, and a second polyimide layer directly disposed on the second metal foil, the first polyimide layer being in contact with the second polyimide layer. The metal clad laminate of the present disclosure is equivalent to a double-sided flexible copper clad laminate (FCCL) in structure, is superior to a single-sided FCCL in terms of mechanical performance in reducing warpage, and has the advantage of being useful for circuit fabrication simultaneously on both sides thereof.

Metal clad laminate, preparation method thereof, and method for preparing flexible circuit board by using the same

The present invention provides a polyimide precursor composition comprising an amic acid ester oligomer of Formula (1): and wherein G, P, R, R, P', D, E and m are as defined herein. The present invention also provides a dry film containing the polyimide precursor composition, as well as a polyimide film and polyimide laminate prepared from the composition.

Polyimide precursor composition and use thereof

The present invention provides a process for preparing polyimides. The process includes cyclizing a polyimide precursor composition in a vacuum-like environment by using infrared radiation to give polyimide. The process can effectively reduce the cyclization temperature and time, thereby reducing energy and process costs.

Process for preparing polyimides

The present disclosure relates to a solvent-containing dry film and a method for applying a dry film on a substrate. The dry film includes a carrier and a resin layer. The resin layer contains a resin composition and a solvent and the solvent is present in a total amount of at least 5 wt % based on the total weight of the resin layer. The dry film of the present invention can be applied onto a substrate without the use of a prior art vacuum lamination apparatus. The application process is simple and is more cost-efficient than the prior art techniques.

Solvent-containing dry film and method for applying the same on a substrate

A polyimide dry film including a carrier and a polyimide layer and a method of using the same are provided. The polyimide layer contains (a) a polyimide precursor or soluble polyimide and (b) a solvent. The solvent includes a hydrophilic solvent and a hydrophobic solvent and a weight ratio of the hydrophilic solvent to the hydrophobic solvent is in the range of about 0.05 to about 2. The polyimide dry film of the present invention has water absorbability, is relatively stable even in the presence of water, and has a non-sticky surface. The resulting polyimide has excellent physical properties and can be used in a process in which water or an aqueous solution is involved to form a coverlay with excellent physical properties.

Polyimide dry film and application thereof

A polyimide (PI) having two &#x2014;COOH capping groups at each end is provided. A coating composition is further provided, which contains the PI and a hardening agent having 2 to 6 functional groups capable of reacting with &#x2014;COOH. A PI coating layer and PI film formed by the coating composition of the present invention possess excellent chemical resistance and coefficient of thermal expansion (CTE), which makes them applicable in fabrication of protective materials for active/passive devices, optical materials, touch panels, copper foil substrates, soft flexible electronic materials or integrated circuit elements, or film substrate for glass film touch panels.

Polyimides, coating composition formed therefrom and use thereof

The present invention provides a base generator having the structure of formula (1): wherein R, R, R, R, R, and Yare defined as in the specification. The base generator of the present invention can be used for imidization of a polyimide precursor, promoting crosslinking of epoxy monomers, or crosslinking of polyurethane or polyurea.

Base generator

The present invention provides a polyimide precursor composition comprising a polyimide precursor and a thermal base generator having the structure of formula (1): wherein R, R, R, R, Rand Yare as defined in the specification. The present invention also provides a polyimide prepared from the aforementioned precursor composition, and a preparation method thereof.

Polyimide precursor composition and preparation method and use thereof

The present invention relates to an isocyanate-modified photosensitive polyimide. The photosensitive polyimide of the invention possesses excellent heat resistance, chemistry resistance, and flexibility, and can be used as a liquid photo resist or dry film resist, or used in a solder resist, coverlay film, or printed wiring board.

Photosensitive polyimides

The invention pertains to an isocyanate-modified photosensitive polyimide. The photosensitive polyimide of the invention possesses excellent heat resistance, chemical resistance and flexibility, and can be used in a liquid photo resist composition or dry film photo resist composition, or used in a solder resist, coverlay film, or printed wiring board.

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Kaohsiung, Taiwan

Meng-Yen Chou