Acm Research (shanghai) Inc.

Meng Wu

Hui Wang

Jian Wang

Zhaowei Jia

Chenhua Lu

Quan Cao

Disclosed is a substrate processing method, which comprises the following steps: S: transferring a substrate plated with a first metal layer from a first plating chamber to a second plating chamber; S: after transferring the substrate to the second plating chamber, forming a water film layer on the front side of the substrate; S: electroplating a second metal layer on the first metal layer. By means of a step of forming a water film layer before electroplating in a plating chamber, the present invention has advantages of preventing delamination between two metal layers and solving product recess abnormality.

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Shanghai, China

Meng Wu