Hon Hai Precision Industry Co., Ltd.

Fu Zhun Precision Industry (shen Zhen) Co., Ltd.

Foxconn Technology Co., Ltd.

Meng-Tzu Lee

Shu-Ho Lin

Fang-Xiang Yu

Jian-Qing Sheng

Ming-Kun Cao

A heat dissipating device includes a heat receiver, a fin member arranged on the heat receiver and including a plurality of spaced fins, a plurality of heat pipes connecting the heat receiver with the fin member, and a fan located at one side of the fin member for producing airflow to the fin member. One half-bowl-shaped guiding structure is formed at each of the fins for guiding the airflow produced by the fan to blow to portions of the fin member adjacent the heat pipe.

Heat dissipating device

A locking device () for securing a heat sink () to a heat generating component () includes a pair of operating members () and a pair of locking members (). Each operating member includes a pivot shaft () defining an axis and an operation handle () extending from the pivot shaft along a first direction. The pivot shaft has an offset section () offsetting from the axis thereof in a second direction. The first direction and the second direction form an angle therebetween. Each locking member is attached to the offset section of one of the operating members. The operation handle of each operating member is capable of rotating about the axis of the pivot shaft from an unlocked position to a locked position and accordingly the offset section of the pivot shaft drives the locking member to move upwardly.

Locking device for heat sink

A heat dissipation device for dissipating heat from an electronic package comprises a heat sink, a fan, a fan mounting structure, and fixing devices. The heat sink comprises a main body which comprises a cutout on each corner. The fan mounting structure mounts on two opposite sides of the heat sink and the fixing devices fix the fan on the fan mounting structure wherein the fixing devices extend through the mounting structure into the cutouts and do not damage the heat sink. The fan mounting structure has two lower plates fitted into two grooves in two opposite sides of the heat sink. Each lower plate extends along a whole length of each of the grooves.

Heat dissipation device

A retaining device () for mounting a heat sink () to an electronic device () includes an unitary metal wire clip (), a locking device () and a camming member (). The clip includes a pair of spaced apart pressing beams (), at least one latching beam () and a crossbeam (). The latching beam is set at one side of the pressing beams. The crossbeam extends between the pressing beams at an opposite side thereof. The camming member is pivotably attached to the locking device and includes a cam () being engageable with the crossbeam. The camming member is pivotable relative to the locking device from an unlocked position to a locked position and the pressing beams force the heat sink into close contact with the electronic device when the camming member is located at the locked position.

Retaining device for heat sink

A fan holder, for attaching a fan to a heat sink, includes a base, fasteners, and clamping arms. The fasteners extend from the base. Each of the fasteners defines an arc-shaped locking portion engaging with the fan. The clamping arms extend from the base opposite to the fasteners, and engage with the heat sink to thereby attach the fan to the heat sink.

Fan holder

A heat dissipation device includes a heat sink (), thermal interface material () spread on a bottom surface () of the heat sink, two legs () of a clip () disposed at opposite sides of the heat sink, and a protective cap () enclosing the thermal interface material therein. The protective cap includes ears () interlocked with the legs of the clip to retain the protective cap to the heat sink. The legs of the clip are also used for interlocking with engaging member () on a printed circuit board () thereby firmly mounting the heat sink to a CPU () on the printed circuit board.

Heat dissipation device having cap for protecting thermal interface material thereon

A heat dissipating device incorporating heat pipes is disclosed. The heat dissipating device includes a base, a plurality of heat-dissipating fins and at least one heat pipe. The heat pipe includes an evaporating portion attached to the base, a middle-portion and a condensing portion extending through the fins. Bottoms of the evaporating portion of the heat pipe and the base are coplanar, and the condensing portion extends opposite to the evaporating portion.

Heat dissipating device with heat pipe

A heat dissipating device incorporating heat pipes is disclosed. The heat dissipating device includes a base (), a plurality of heat-dissipating fins () and at least one heat pipe (). The base defines at least a groove () thereon. The heat pipe comprises an evaporating portion () received in the groove and a condensing portion () extending through the fins. The evaporating portion of the heat pipe is curved so as to increase contact surface between the evaporating portion and the base. The condensing portion of the heat pipe extends perpendicularly away from the base.

Growing community of inventors

Tu-Cheng, Taiwan

Meng-Tzu Lee