Macronix International Co., Ltd.

Meng-Tsung Ko

Chin-Ta Su

Yung-Tai Hung

A method of forming a conductive plug is disclosed. A material layer having at least one opening is provided on a substrate. A first conductive layer is deposited in the opening, wherein the first conductive layer does not completely fill up the opening. A second conductive layer is deposited on the first conductive layer. A surface treatment is performed after the step of depositing the first conductive layer and before the step of depositing the second conductive layer, so that the first deposition rate of the second conductive layer at the lower portion of the opening is greater the second deposition rate of the second conductive layer at the upper portion of the opening. A void-free conductive plug can be easily formed with the method of the invention.

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Hsinchu, Taiwan

Meng-Tsung Ko